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IS25LP256D-RMLE-TR

Integrated Silicon Solution

IS25LP256D-RMLE-TR by Integrated Silicon Solution

IS25LP256D-RMLE-TR by Integrated Silicon Solution is a 32MX8 Flash Memory with 268Mbit memory density. It operates at 133MHz clock frequency, suitable for industrial applications. With a supply voltage range of 2.3V to 3.6V, it offers synchronous operation in a small outline package for space-constrained designs.

Median Price

$5.580

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,572 parts In-Stock

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$5.580

100+ parts

$4.960

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$4.960

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Distributors (In-Stock)

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Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$3.762

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83

$3.762

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Vyrian

USA . 8,022 parts In-Stock

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8,022

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Chip Stock

USA . 1,000 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 34 parts In-Stock

1+ parts

$3.489

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34

$3.489

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Bastille Electronics

Australia . 97 parts In-Stock

1+ parts

$3.762

100+ parts

$3.574

1k+ parts

$3.395

10k+ parts

$3.348

97

$3.762

$3.574

$3.395

$3.348

Continental Prestige Electronics

USA . 2,952 parts In-Stock

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$3.762

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$3.687

2,952

$3.762

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$3.687

Argo Parts USA

USA . 779 parts In-Stock

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$3.762

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779

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Aztec Data Supply Inc.

USA . 119 parts In-Stock

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$3.890

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AZTECH Wire

Italy . 534 parts In-Stock

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$13.609

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Perfect Parts

USA . 4,480 parts In-Stock

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Overview

Unlock the power of high-quality flash memory with the IS25LP256D-RMLE-TR by Integrated Silicon Solution. Offering reliable performance and versatile applications, this product embodies the excellence of its manufacturer. Ideal for industrial use, this small-outline memory chip boasts a fast clock frequency of 133 MHz and a wide temperature range from -40 to 105°C. Trust in the value and benefits that this flash memory brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material choice for long-lasting performance.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfer, enhancing overall efficiency.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency allows for fast data processing and read/write speeds.

Technology: CMOS

CMOS technology offers low power consumption for energy efficiency.

Memory Density: 268435456 bit

High memory density provides ample storage capacity for data.

Technical Specifications

Flash Memory IS25LP256D-RMLE-TR attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Clock Frequency (fCLK):

133 MHz

JESD-30 Code:

R-PDSO-G16

Length:

10.31 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

IS25LP256D-RMLE-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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