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SGB15N120

Infineon Technologies

SGB15N120 by Infineon Technologies

SGB15N120 by Infineon Technologies is an N-CHANNEL IGBT transistor with a max Collector-Emitter Voltage of 1200V and Max Collector Current of 30A. It is designed for POWER CONTROL applications, featuring a rise time of 24ns and fall time of 26ns. This RECTANGULAR package has GULL WING terminals and can handle up to 198W power dissipation at a max operating temperature of 150°C.

Median Price

$2.565

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$2.565

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$2.565

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Vyrian

USA . 1,584 parts In-Stock

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1,584

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ComSIT Distribution GmbH

Germany . 699 parts In-Stock

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699

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Digiode

USA . 75 parts In-Stock

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75

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J2 Sourcing AB

Sweden . 50 parts In-Stock

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50

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Distributors (Availability)

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.565

100+ parts

$2.514

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$2.565

$2.514

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Modulus Dynamics

Lithuania . 25,909 parts In-Stock

1+ parts

$3.917

100+ parts

$3.760

1k+ parts

$3.604

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25,909

$3.917

$3.760

$3.604

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Component Stockers USA

USA . 2,737 parts In-Stock

1+ parts

$8.840

100+ parts

$8.400

1k+ parts

$8.140

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2,737

$8.840

$8.400

$8.140

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Ampacity Inc.

Singapore . 1,037 parts In-Stock

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$11.050

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1,037

$11.050

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AZTECH Wire

Italy . 205 parts In-Stock

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$14.714

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Assy Fe

Spain . 7,460 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,616 parts In-Stock

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Corphita

USA . 835 parts In-Stock

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Overview

Unlock the power of efficient and reliable power control with the SGB15N120 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that offer superior performance and durability. Ideal for a wide range of applications, this N-CHANNEL transistor is perfect for driving motors, inverters, and other power control systems. Experience seamless operation with fast rise and fall times, ensuring optimal efficiency. Trust in the trusted name of Infineon to provide you with the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers high efficiency and faster switching speeds, making it suitable for power control applications.

Configuration: SINGLE

Simplified design and easy integration into circuits, making it user-friendly for applications requiring a single IGBT.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency in managing power flow.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, making it reliable for industrial and power electronics applications.

Maximum Collector-Emitter Voltage: 1200 V

Can handle high voltage applications, making it suitable for power control circuits that require high voltage switching capabilities.

Maximum Collector Current (IC): 30 A

Capable of handling high current loads, making it suitable for power management applications that require effective current control.

Maximum Power Dissipation (Abs): 198 W

Can dissipate high power levels efficiently, ensuring reliable operation even under high power conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGB15N120 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

26 ns

Maximum Gate-Emitter Threshold Voltage:

5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

24 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

683 ns

Nominal Turn On Time (ton):

68 ns

Trade Compliance

SGB15N120 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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