Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; No. of Functions: 1;
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Flash Memory S25HL512TDPNHV013 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies
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S25HL512TDPNHV013 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
1552200168
Molex
WIRE AND CABLE;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
Baneasa S A
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
M25P32-VME6G
STMicroelectronics
STMicroelectronics M25P32-VME6G is a 32Mb NOR Flash Memory with SPI interface, operating at 50MHz clock frequency. It offers 100000 Write/Erase cycles endurance and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage.
S25FL128SAGMFIR01
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
SST39SF040-55-4I-NHE
Silicon Storage Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SST25VF016B-50-4I-QAF
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Programming Voltage (V): 2.7;
SST25VF040B-50-4I-SAF
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 100;
S29GL032N90TFI040
Infineon Technologies
S29GL032N90TFI040 by Infineon Technologies is a 32Mb NOR flash memory with 2MX16 organization, operating at 3V. It features an industrial temperature grade, parallel interface, and offers fast access time of 90ns. Ideal for applications requiring high-speed data storage in harsh environments.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
W25Q16JVSNIQ
Winbond Electronics
W25Q16JVSNIQ by Winbond Electronics is a 16Mb flash memory with synchronous operation, 133 MHz clock frequency, and 3.3V supply voltage. It is ideal for industrial applications requiring high-speed data storage in a small outline package.
XCF04SVOG20C
Xilinx
Xilinx XCF04SVOG20C is a 4MX1 NOR flash memory with 4194304-bit density. Operating at 3.3V, it offers 20000 write/erase cycles and supports synchronous mode up to 33MHz clock frequency. Ideal for configuration memory in applications requiring high endurance and low standby current.
AT45DB081E-SHN2B-T
Renesas Electronics
AT45DB081E-SHN2B-T by Renesas Electronics is a 1MX8 NOR type flash memory with 3-STATE output. It operates at 133 MHz clock frequency, has 100000 Write/Erase Cycles endurance, and uses SPI serial bus. Ideal for industrial applications requiring high-speed data storage in compact devices.
AT45DB161E-SHD-B
Silicon Labs
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e4;
THGBMJG6C1LBAU7
Kioxia Holdings
THGBMJG6C1LBAU7 by Kioxia Holdings is an 8GX8 flash memory IC with 68719476736 bit memory density. It operates b/w -40 to 105 °C, suitable for industrial applications. With a terminal pitch of 0.5 mm and package style GRID ARRAY, it's ideal for compact electronic devices.
SST26VF064BT-104I/SM
Microchip Technology
SST26VF064BT-104I/SM by Microchip: 64MX1 organization, 104 MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring NOR flash memory with 100000 write/erase cycles and 67108864 bit memory density.
MT29F2G16ABAEAWP:ETR
Micron Technology
Micron Technology's MT29F2G16ABAEAWP:ETR is a 3.3V SLC NAND flash memory with 128Mx16 organization and 2147483648-bit memory density. Operating in asynchronous mode, it has a temperature range of 0-70°C and is suitable for commercial applications requiring high-speed parallel memory access.
AT45DB641E-MWHN-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
MT25QL128ABA1ESE-0SITTR
Micron Technology's MT25QL128ABA1ESE-0SITTR is a 16Mx8 flash memory IC with 134,217,728-bit density. Operating at 133MHz clock frequency and 3V programming voltage, it suits industrial applications requiring small outline packages and synchronous operation.
MTFC8GAKAJCN-4MIT
MTFC8GAKAJCN-4MIT by Micron Technology is a 8GX8 MLC NAND flash memory with 52 MHz clock frequency. It operates in industrial temperature range (-40 to 85 °C) and has a memory density of 68719476736 bit. Ideal for applications requiring high-speed data storage in compact devices.
AT45DB161D-SU-SL954
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
W25Q64JVSSIQTR
W25Q64JVSSIQTR by Winbond Electronics is a NOR type flash memory with 8MX8 organization, 133 MHz clock frequency, and 3.3V programming voltage. It is ideal for applications requiring high-speed synchronous operation, such as automotive electronics and industrial control systems.
S25FL512SAGMFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 100000 Write/Erase Cycles;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
S25HS02GTDPBHV150
S25HS02GTDPBHV150 by Infineon Technologies is a 256MX8 NOR type flash memory with a max clock frequency of 166 MHz. It operates in synchronous mode and has a min data retention time of 25 years. This flash memory is commonly used in applications such as consumer electronics, automotive systems, and industrial equipment.
S25HL01GTFAMHI010
S25HL01GTFAMHI010 by Infineon Technologies is a NOR type Flash Memory with 128Mx8 organization, operating at 166 MHz clock frequency. It has a small outline package style, synchronous mode, and SPI serial bus type. Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage in compact electronic devices.
S25HL01GTDPMHI013
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00056 Amp; Terminal Position: DUAL;
S25HL01GTDPBHI030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Width: 8 mm; Minimum Supply Voltage (Vsup): 2.7 V;
S25HL01GTDPMHA010
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100; Maximum Clock Frequency (fCLK): 133 MHz;
S25HL01GTDPMHI010
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Surface Mount: YES;
S25HL01GTDPBHV030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Programming Voltage (V): 3;
S25HL01GTDPMHM010
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 134217728 words; Maximum Operating Temperature: 125 Cel;
S25HL01GTDPBHA033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Terminal Pitch: 1 mm;
S25HL01GTDPMHA011
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Write Protection: HARDWARE; Endurance: 2560000 Write/Erase Cycles;
S25HL01GTDPBHI033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Organization: 128MX8;
S25HL01GTDPMHA013
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100; Write Protection: HARDWARE;
S25HL01GTDPMHB013
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 2560000 Write/Erase Cycles; Minimum Supply Voltage (Vsup): 2.7 V;
S25HL01GTDPBHM033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; Minimum Data Retention Time: 25;
S25HL01GTDPMHI011
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: SPI; Operating Mode: SYNCHRONOUS;
S25HL01GTDPBHB033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Memory Density: 1073741824 bit; Parallel or Serial: SERIAL;
S25HL01GTDPMHB010
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V; Maximum Operating Temperature: 105 Cel;
S25HL01GTDPBHV033
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Serial Bus Type: SPI; Moisture Sensitivity Level (MSL): 3;
S25HL01GTDPBHA030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Technology: CMOS; Maximum Standby Current: .00056 Amp;
S25HL01GTDPBHB030
FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Surface Mount: YES; Endurance: 2560000 Write/Erase Cycles;
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