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JANSR2N7269U

Infineon Technologies

JANSR2N7269U by Infineon Technologies

JANSR2N7269U by Infineon Technologies is a N-CHANNEL FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 104A IDM, 0.11 ohm RDS(on), and 500mJ EAS rating. Package style is CHIP CARRIER with METAL-OXIDE SEMICONDUCTOR technology and TIN LEAD finish.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 1,617 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Digiode

USA . 360 parts In-Stock

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Resion

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Modulus Dynamics

Lithuania . 14,526 parts In-Stock

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$0.863

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$0.828

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$0.794

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AZTECH Wire

Italy . 250 parts In-Stock

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Semicontronic

India . 1,247 parts In-Stock

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$28.050

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$27.349

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$27.208

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Ampacity Inc.

Singapore . 1,504 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,186 parts In-Stock

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Continental Prestige Electronics

USA . 3,635 parts In-Stock

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Argo Parts USA

USA . 1,467 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the JANSR2N7269U by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled performance in switching applications. With a high DS Breakdown Voltage of 200V and a maximum Drain Current of 26A, this N-CHANNEL transistor is designed for efficiency and reliability. Say goodbye to power limitations and hello to seamless operation with the JANSR2N7269U. Elevate your projects to new heights with this top-of-the-line component from a trusted manufacturer. Experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides high durability and reliability, making this FET suitable for demanding industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, ensuring efficient operation in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy circuit design and can provide protection against reverse currents, enhancing the overall functionality of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance for efficient power management.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this FET can handle high voltage levels safely, making it suitable for a wide range of power applications.

Maximum Pulsed Drain Current (IDM): 104 A

The high pulsed drain current rating ensures the FET can handle peak power demands without overheating or failing, making it reliable in high-stress situations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low leakage currents and high input impedance, improving the overall efficiency and performance of the FET.

Maximum Drain-Source On Resistance: 0.11 ohm

The low drain-source on resistance results in minimal power loss and increased efficiency during operation, making this FET an excellent choice for power management applications.

Technical Specifications

Power Field Effect Transistors (FET) JANSR2N7269U attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

RADIATION HARDENED

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

26 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-CBCC-N3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

104 A

Qualification:

Qualified

Reference Standard:

MIL-19500/603

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

JANSR2N7269U Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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