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JANS2N6849

Infineon Technologies

JANS2N6849 by Infineon Technologies

JANS2N6849 by Infineon Technologies is a P-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max IDM of 25A and EAS of 92mJ, this ENHANCEMENT MODE transistor has a 0.345 ohm RDS(ON) and operates up to 150°C.

Median Price

$47.869

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 5 parts In-Stock

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$47.869

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$50.262

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$47.390

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Digiode

USA . 780 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 90 parts In-Stock

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Sunrise Surplus Inc.

USA . 44 parts In-Stock

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Q Components

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Electronics Depot

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 189 parts In-Stock

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$0.294

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$0.381

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$0.362

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$0.362

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870

$0.381

$0.362

$0.362

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Modulus Dynamics

Lithuania . 9,486 parts In-Stock

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$0.390

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$0.374

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$0.359

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Corohmni

South Africa . 904 parts In-Stock

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AZTECH Wire

Italy . 293 parts In-Stock

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$9.694

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Ampacity Inc.

Singapore . 1,025 parts In-Stock

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$47.050

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Continental Prestige Electronics

USA . 5,715 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Bastille Electronics

Australia . 120 parts In-Stock

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Corphita

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Overview

Discover the power and reliability of the JANS2N6849 by Infineon Technologies, a top-tier manufacturer known for its superior quality products. This P-CHANNEL Power Field Effect Transistor (FET) with a built-in diode is perfect for switching applications, offering a high DS breakdown voltage of 100V and a maximum pulsing drain current of 25A. With a cylindrical package shape and wire terminals, this transistor provides enhanced performance with a low on-resistance of 0.345 ohm. Trust Infineon Technologies to deliver cutting-edge technology that meets your highest expectations.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal as the package body material provides durability and efficient heat dissipation, ensuring reliable performance even in high temperature environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high input impedance, making them suitable for efficient power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient protection against reverse current flow, enhancing the reliability and safety of the transistor in various switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power consumption, making it ideal for use in power management circuits.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage of 100V, this FET can handle high voltage levels safely, making it suitable for use in a variety of industrial and automotive applications.

Maximum Pulsed Drain Current (IDM): 25 A

The high maximum pulsed drain current rating of 25A allows for reliable performance under high current loads, making it suitable for power switching applications that require high current handling capabilities.

Maximum Power Dissipation (Abs): 25 W

With a maximum power dissipation rating of 25W, this FET can efficiently dissipate heat during operation, ensuring stability and reliability in high power applications.

Technical Specifications

Power Field Effect Transistors (FET) JANS2N6849 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

92 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

.345 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-205AF

JESD-30 Code:

O-MBCY-W3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Qualification:

Qualified

Reference Standard:

MIL-19500/564

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

JANS2N6849 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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