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JANSR2N7433

Infineon Technologies

JANSR2N7433 by Infineon Technologies

JANSR2N7433 by Infineon Technologies is a N-CHANNEL FET with 200V DS breakdown voltage, ideal for switching applications. Featuring a max IDM of 140A and EAS of 500mJ, it operates in enhancement mode with a max power dissipation of 250W. This MOSFET has a TOFF of 330ns and TON of 250ns, suitable for high-power requirements in various industries.

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 1,274 parts In-Stock

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Digiode

USA . 810 parts In-Stock

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Nova Conductors

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Modulus Dynamics

Lithuania . 8,829 parts In-Stock

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$1.699

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$1.631

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$1.563

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AZTECH Wire

Italy . 386 parts In-Stock

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$7.056

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Semicontronic

India . 1,605 parts In-Stock

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$33.050

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$32.224

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$32.058

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Continental Prestige Electronics

USA . 5,334 parts In-Stock

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Argo Parts USA

USA . 2,299 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 81 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the JANSR2N7433 Power Field Effect Transistor by Infineon Technologies. Built with precision and expertise, this N-CHANNEL transistor offers unmatched performance in switching applications. With a high DS Breakdown Voltage, maximum Pulsed Drain Current, and Avalanche Energy Rating, this FET delivers exceptional reliability and efficiency. Experience seamless operation and enhanced functionality with the JANSR2N7433, setting new standards in the field of semiconductor technology. Elevate your projects with the quality and innovation that only Infineon Technologies can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability, making this FET suitable for harsh operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher mobility and conductivity compared to P-channel FETs, allowing for efficient switching and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against reverse current flow, making this FET convenient and versatile.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast operation and high efficiency in turning on and off.

Minimum DS Breakdown Voltage: 200 V

With a minimum breakdown voltage of 200V, this FET can handle high voltage applications reliably.

Maximum Pulsed Drain Current (IDM): 140 A

The high pulsed drain current rating of 140A allows this FET to handle large transient currents, making it suitable for power electronics applications.

Avalanche Energy Rating (EAS): 500 mJ

The high avalanche energy rating of 500mJ indicates the FET's ability to withstand high energy spikes during switching, ensuring reliability and stability in operation.

Maximum Power Dissipation (Abs): 250 W

With a maximum power dissipation of 250W, this FET can dissipate heat effectively and operate at high power levels without overheating.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows this FET to be used in demanding environments without sacrificing performance or reliability.

Maximum Drain Current (ID): 35 A

The high drain current rating of 35A enables this FET to handle substantial continuous currents, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.077 ohm

The low drain-source on resistance of 0.077 ohms reduces power losses and improves efficiency in conducting current, making this FET an optimal choice for high-performance circuits.

Technical Specifications

Power Field Effect Transistors (FET) JANSR2N7433 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

35 A

Maximum Drain-Source On Resistance:

.077 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

360 pF

JEDEC-95 Code:

TO-254AA

JESD-30 Code:

S-CSFM-P3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

SQUARE

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

140 A

Qualification:

Qualified

Reference Standard:

MIL-19500/663

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

PIN/PEG

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

330 ns

Maximum Turn On Time (ton):

250 ns

Trade Compliance

JANSR2N7433 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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