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IRLR7821TRLPBF

Infineon Technologies

IRLR7821TRLPBF by Infineon Technologies

IRLR7821TRLPBF by Infineon Technologies is a N-CHANNEL Power FET with 30V DS Breakdown Voltage. It features a max IDM of 260A and EAS of 230mJ, suitable for SWITCHING applications. This SINGLE transistor has a max ID of 65A, 0.01 ohm RDS(on), and operates in ENHANCEMENT MODE up to 175°C.

Median Price

$29.958

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 310 parts In-Stock

1+ parts

$59.600

100+ parts

$31.900

1k+ parts

$25.500

10k+ parts

$25.000

310

$59.600

$31.900

$25.500

$25.000

Mouser Electronics

USA . 6,230 parts In-Stock

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-

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$0.315

6,230

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$0.315

Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$0.464

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600

$0.464

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Chip Stock

USA . 24,495 parts In-Stock

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24,495

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Vyrian

USA . 6,050 parts In-Stock

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Component Sense

UK . 4,763 parts In-Stock

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Digiode

USA . 687 parts In-Stock

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687

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Distributors (Availability)

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Semicontronic

India . 6,169 parts In-Stock

1+ parts

$0.268

100+ parts

$0.261

1k+ parts

$0.260

10k+ parts

-

6,169

$0.268

$0.261

$0.260

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Ampacity Inc.

Singapore . 6,024 parts In-Stock

1+ parts

$0.268

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6,024

$0.268

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Argo Parts USA

USA . 2,601 parts In-Stock

1+ parts

$0.395

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$0.383

2,601

$0.395

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$0.383

Continental Prestige Electronics

USA . 1,785 parts In-Stock

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$0.395

100+ parts

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$0.387

1,785

$0.395

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$0.387

Advanced Electronics

New Zealand . 10 parts In-Stock

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$0.403

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$0.403

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$0.403

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10

$0.403

$0.403

$0.403

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Aztec Data Supply Inc.

USA . 2,105 parts In-Stock

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$0.449

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2,105

$0.449

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Modulus Dynamics

Lithuania . 305 parts In-Stock

1+ parts

$1.037

100+ parts

$0.996

1k+ parts

$0.954

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305

$1.037

$0.996

$0.954

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Corohmni

South Africa . 283 parts In-Stock

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$1.940

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283

$1.940

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Lixinc

USA . 19,238 parts In-Stock

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Perfect Parts

USA . 3,340 parts In-Stock

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Corphita

USA . 966 parts In-Stock

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966

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Microchip USA

USA . 282 parts In-Stock

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282

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Overview

Experience superior performance and reliability with the IRLR7821TRLPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a maximum drain current of 65 A and a low on-resistance of 0.01 ohm, this N-channel transistor offers exceptional efficiency and power handling capabilities. Whether you're looking to optimize your system's performance or enhance its overall functionality, the IRLR7821TRLPBF provides the value and benefits you need to take your projects to the next level. Upgrade your designs today with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher electron mobility and faster switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage, enhancing the efficiency and reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents and voltages with minimal power loss.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can operate safely in circuits with fluctuating voltages and prevent damage from voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into existing circuit designs, optimizing space and efficiency.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and easy soldering, ensuring reliable performance in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low on-resistance, enabling precise control and efficient operation in switching applications.

Maximum Pulsed Drain Current (IDM): 260 A

The high pulsed drain current rating allows this FET to handle sudden surges in current, making it suitable for applications with variable loads.

Avalanche Energy Rating (EAS): 230 mJ

The high avalanche energy rating ensures the FET can withstand transient overloads and voltage spikes, increasing its reliability and lifespan.

Maximum Drain Current (Abs) (ID): 65 A

With a high drain current rating, this FET can handle continuous high currents without overheating, making it reliable for demanding applications.

No. of Terminals: 3

The three terminals provide the necessary connections for efficient operation and control of the FET in various circuit configurations.

Maximum Power Dissipation (Abs): 75 W

With a high power dissipation rating, this FET can handle significant heat loads and operate reliably in high-power applications.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and streamlined design, suitable for applications where space is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low power consumption, and excellent thermal stability, making this FET ideal for efficient power management.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows the FET to function reliably in elevated temperature environments without compromising performance.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability, low leakage currents, and excellent thermal stability, ensuring long-term performance and durability.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin finish over nickel terminals provides corrosion resistance and secure solder connections, enhancing the FET's durability and performance.

Maximum Drain-Source On Resistance: 0.01 ohm

With a low on-resistance, this FET minimizes power loss and heat generation during operation, making it efficient for high-current applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, making it easy to integrate this FET into various circuit layouts.

Case Connection: DRAIN

The drain connection simplifies the FET's circuit layout and connection, enhancing the overall efficiency and performance of the device.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this FET can withstand the reflow process without compromising its electrical properties, ensuring reliable solder connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating allows for efficient soldering and bonding of the FET to the circuit board, ensuring strong and reliable connections.

Technical Specifications

Power Field Effect Transistors (FET) IRLR7821TRLPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

260 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLR7821TRLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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