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IRLR6225TRPBF

Infineon Technologies

IRLR6225TRPBF by Infineon Technologies

Infineon's IRLR6225TRPBF is a N-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 400A IDM, 170mJ EAS, and 0.004ohm RDS(ON). With a max power dissipation of 63W and operating temperature up to 150°C, it's suitable for high-power electronic systems.

Median Price

$0.709

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 25 parts In-Stock

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$0.133

100+ parts

$0.129

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25

$0.133

$0.129

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Future Electronics

Canada . 50 parts In-Stock

1+ parts

$0.885

100+ parts

$0.735

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$0.615

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$0.885

$0.735

$0.615

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Mouser Electronics

USA . 1,958 parts In-Stock

1+ parts

$1.140

100+ parts

$0.591

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$0.421

10k+ parts

$0.356

1,958

$1.140

$0.591

$0.421

$0.356

EBV Elektronik

Germany . 2,000 parts In-Stock

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Chip1Stop

Japan . 1,864 parts In-Stock

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Verical

USA . 1,864 parts In-Stock

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$0.627

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$0.453

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$0.403

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$0.627

$0.453

$0.403

Farnell

UK . 654 parts In-Stock

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$0.696

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$0.431

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$0.422

654

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$0.696

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$0.422

Element14

Singapore . 654 parts In-Stock

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$0.722

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$0.447

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$0.438

654

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$0.447

$0.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

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$0.573

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$0.573

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Digiode

USA . 506 parts In-Stock

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$0.831

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$0.831

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TME

Poland . 545 parts In-Stock

1+ parts

$1.080

100+ parts

$0.571

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$0.458

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545

$1.080

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$0.458

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Vyrian

USA . 2,461 parts In-Stock

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NAC Semi

USA . 2,000 parts In-Stock

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$0.680

2,000

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$0.680

ComSIT Distribution GmbH

Germany . 310 parts In-Stock

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Chip Stock

USA . 209 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,129 parts In-Stock

1+ parts

$0.323

100+ parts

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2,129

$0.323

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Argo Parts USA

USA . 2,062 parts In-Stock

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$0.573

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$0.556

2,062

$0.573

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$0.556

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.573

100+ parts

$0.561

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500

$0.573

$0.561

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$0.584

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$0.584

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$0.584

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60

$0.584

$0.584

$0.584

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Semicontronic

India . 1,987 parts In-Stock

1+ parts

$0.700

100+ parts

$0.682

1k+ parts

$0.679

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1,987

$0.700

$0.682

$0.679

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Corohmni

South Africa . 1,175 parts In-Stock

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$0.724

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Corphita

USA . 510 parts In-Stock

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$0.788

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Modulus Dynamics

Lithuania . 13,830 parts In-Stock

1+ parts

$1.612

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$1.548

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$1.483

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$1.612

$1.548

$1.483

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Aztec Data Supply Inc.

USA . 46,567 parts In-Stock

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$1.714

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Kepictronics

USA . 52,135 parts In-Stock

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Perfect Parts

USA . 47,607 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 11,980 parts In-Stock

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Lixinc

USA . 10,096 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,914 parts In-Stock

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Infinite Electronics LLP (Excess)

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Alle Elektronik GmbH

Germany . 4,609 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Assy Fe

Spain . 2,000 parts In-Stock

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Microchip USA

USA . 1,676 parts In-Stock

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1,676

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Continental Prestige Electronics

USA . 1,325 parts In-Stock

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$0.678

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$0.413

10k+ parts

$0.398

1,325

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$0.678

$0.413

$0.398

Robosynatics

Brazil . 950 parts In-Stock

1+ parts

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$9.342

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$9.342

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$9.342

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$9.342

$9.342

$9.342

Lucentia Tech

USA . 950 parts In-Stock

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$9.342

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$9.342

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$9.342

950

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$9.342

$9.342

$9.342

Overview

Experience the power of innovation with the IRLR6225TRPBF by Infineon Technologies. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability, making it ideal for a variety of switching applications. With its single configuration and built-in diode, this transistor delivers maximum efficiency and seamless operation. Trust in Infineon Technologies to provide cutting-edge technology that exceeds expectations. Elevate your projects with the IRLR6225TRPBF and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high conductivity and efficiency, making them suitable for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency and performance of the transistor, making it a versatile component for switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast and reliable switching capabilities for optimal performance.

Surface Mount: YES

Being surface-mountable allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V ensures reliable operation and protection against voltage spikes, making it suitable for a range of electrical systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and soldering onto circuit boards, enhancing the overall usability of the FET.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, ensuring stable performance in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers fast switching speeds and low on-resistance, improving efficiency and performance in switching applications.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current rating of 400A allows for robust and reliable operation in demanding conditions, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 170 mJ

The high avalanche energy rating of 170mJ ensures protection against voltage spikes and transient events, enhancing the reliability of the FET.

Maximum Drain Current (Abs) (ID): 100 A

The maximum drain current rating of 100A allows for high current handling capacity, making it suitable for applications that require substantial power output.

No. of Terminals: 2

Having two terminals simplifies the connection process and allows for easy integration into circuit designs, making it user-friendly and versatile.

Maximum Power Dissipation (Abs): 63 W

With a maximum power dissipation of 63W, this FET can handle high power levels without thermal issues, ensuring reliable operation under varying load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for compact designs, making it ideal for applications with size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making this FET a reliable choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can handle high-temperature environments, ensuring stable operation in various conditions.

Transistor Element Material: SILICON

Silicon transistors are known for their reliability and performance, making this FET a durable and efficient choice for a wide range of applications.

Terminal Finish: MATTE TIN OVER NICKEL

The terminal finish of matte tin over nickel offers corrosion resistance and reliable connections, ensuring long-term performance and durability.

Maximum Drain Current (ID): 42 A

With a maximum drain current rating of 42A, this FET can handle moderate power levels with efficiency, making it suitable for various applications.

Maximum Drain-Source On Resistance: 0.004 ohm

The low drain-source on-resistance of 0.004 ohms minimizes power loss and ensures efficient operation, making it an ideal choice for high-performance systems.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and ensures proper alignment during installation, enhancing the usability of the FET.

Case Connection: DRAIN

The drain case connection allows for easy and secure mounting, ensuring stable operation and optimal performance in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this FET can be reliably soldered onto circuit boards, simplifying the assembly process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and secure connections, preventing damage during the assembly process.

Technical Specifications

Power Field Effect Transistors (FET) IRLR6225TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

170 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.004 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLR6225TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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