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IRLR3636TRPBF

Infineon Technologies

IRLR3636TRPBF by Infineon Technologies

Infineon's IRLR3636TRPBF is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 396A IDM, 0.0083 ohm RDS(on), and 170mJ EAS rating. This MOSFET operates in ENHANCEMENT MODE, has GULL WING terminals, and comes in a SMALL OUTLINE package.

Median Price

$0.865

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 12 parts In-Stock

1+ parts

$0.214

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$0.214

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$0.214

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12

$0.214

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Chip1Stop

Japan . 4,252 parts In-Stock

1+ parts

$1.930

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4,252

$1.930

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DigiKey

USA . 24,440 parts In-Stock

1+ parts

$2.300

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$1.005

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$0.780

10k+ parts

$0.637

24,440

$2.300

$1.005

$0.780

$0.637

Mouser Electronics

USA . 2,747 parts In-Stock

1+ parts

$2.370

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$1.050

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$0.788

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$0.728

2,747

$2.370

$1.050

$0.788

$0.728

Future Electronics

Canada . 36,000 parts In-Stock

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$0.655

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Element14

Singapore . 20,652 parts In-Stock

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$1.400

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$1.070

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EBV Elektronik

Germany . 8,000 parts In-Stock

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Arrow

USA . 6,000 parts In-Stock

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$0.654

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Verical

USA . 6,000 parts In-Stock

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$0.649

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Rochester

USA . 2,000 parts In-Stock

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$0.865

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$0.718

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$0.640

2,000

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$0.865

$0.718

$0.640

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 476 parts In-Stock

1+ parts

$0.451

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476

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Nova Conductors

Japan . 50 parts In-Stock

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$1.060

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$1.060

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Maritex

Poland . 38,000 parts In-Stock

1+ parts

$1.403

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$0.742

1k+ parts

$0.664

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$0.572

38,000

$1.403

$0.742

$0.664

$0.572

TME

Poland . 787 parts In-Stock

1+ parts

$2.160

100+ parts

$0.984

1k+ parts

$0.696

10k+ parts

$0.598

787

$2.160

$0.984

$0.696

$0.598

Ozdisan Elektronik

Türkiye . 11,604 parts In-Stock

1+ parts

$57.130

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11,604

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Chip Stock

USA . 48,710 parts In-Stock

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IBS Electronics

USA . 42,000 parts In-Stock

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$1.059

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Vyrian

USA . 12,579 parts In-Stock

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Schukat

Germany . 6,300 parts In-Stock

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$0.914

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$0.762

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$0.733

6,300

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$0.914

$0.762

$0.733

NAC Semi

USA . 6,000 parts In-Stock

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$1.190

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$1.190

ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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ComSIT USA

USA . 500 parts In-Stock

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Lantek

USA . 437 parts In-Stock

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Sensible Micro Corp

USA . 121 parts In-Stock

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Demsay Elektronik

Türkiye . 91 parts In-Stock

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Bas Electronics GmbH & Co. KG

Germany . 7 parts In-Stock

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Aztec Data Supply Inc.

USA . 24,019 parts In-Stock

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$0.319

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$0.319

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Semicontronic

India . 10,346 parts In-Stock

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$0.404

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$0.394

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$0.392

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$0.404

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Ampacity Inc.

Singapore . 10,106 parts In-Stock

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$0.404

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Corphita

USA . 541 parts In-Stock

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$0.428

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541

$0.428

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Modulus Dynamics

Lithuania . 3,992 parts In-Stock

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$0.660

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$0.634

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$0.607

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3,992

$0.660

$0.634

$0.607

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.939

100+ parts

$0.892

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$0.892

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100

$0.939

$0.892

$0.892

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Argo Parts USA

USA . 2,729 parts In-Stock

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$1.060

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$1.060

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Corohmni

South Africa . 428 parts In-Stock

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$1.953

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428

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Microchip USA

USA . 6,578 parts In-Stock

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$5.832

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$5.832

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Perfect Parts

USA . 98,784 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Continental Prestige Electronics

USA . 27,403 parts In-Stock

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$1.230

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$0.780

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27,403

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$1.230

$0.780

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QUARKTWIN TECHNOLOGY LTD

USA . 19,304 parts In-Stock

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Lixinc

USA . 12,791 parts In-Stock

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Futuretech Components

Singapore . 12,000 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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GreenTree Electronics

Israel . 11,813 parts In-Stock

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Kepictronics

USA . 10,065 parts In-Stock

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Eastek

USA . 4,000 parts In-Stock

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S.R.D Solutions

India . 3,100 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,757 parts In-Stock

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1,757

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,171 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.039

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$1.007

10k+ parts

$0.986

50

-

$1.039

$1.007

$0.986

Overview

Elevate your power management solutions with the IRLR3636TRPBF by Infineon Technologies. This N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability in switching applications. With a maximum drain current of 50 A and a low on-resistance of 0.0083 ohm, this FET delivers optimal efficiency and power handling capability. Its durable plastic/epoxy package body ensures long-lasting durability, while the built-in diode simplifies circuit design. Trust Infineon's cutting-edge technology and experience seamless operation in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, making it suitable for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently turn on and off high-power circuits with minimal power loss.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs, making it ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage rating offers protection against voltage spikes and ensures reliable operation in high voltage circuits.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space on the PCB and allows for easy placement and soldering during assembly.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical connection and heat dissipation, enhancing the reliability and performance of the FET.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for precise control of the transistor's conductivity, making it suitable for high-speed switching applications.

Maximum Pulsed Drain Current (IDM): 396 A

The high pulsed drain current rating enables the FET to handle large current spikes or surges, making it reliable in high-power applications.

Avalanche Energy Rating (EAS): 170 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy pulses and transient overloads, ensuring robust performance.

No. of Terminals: 2

Having only 2 terminals simplifies the connection and integration of the FET into electronic circuits, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact footprint, making it suitable for space-constrained applications and providing versatility in PCB design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high performance, low power consumption, and reliable operation in a variety of applications.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its stability, low leakage, and high thermal conductivity, ensuring the FET's longevity and efficiency.

Maximum Drain Current (ID): 50 A

The high maximum drain current rating allows the FET to handle significant current flow, making it suitable for high-power applications that require efficient switching.

Maximum Drain-Source On Resistance: 0.0083 ohm

The low drain-source on resistance minimizes power loss and heat generation, improving the efficiency and reliability of the FET in switching operations.

Terminal Position: SINGLE

Having a single terminal position simplifies the circuit connection and reduces the risk of wiring errors, ensuring a secure and reliable electrical connection.

Case Connection: DRAIN

The drain case connection enhances heat dissipation and allows for efficient cooling, ensuring the FET operates within safe temperature limits during high-power switching.

Technical Specifications

Power Field Effect Transistors (FET) IRLR3636TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

170 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0083 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

396 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLR3636TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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