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IRF7805TRPBF-1

Infineon Technologies

IRF7805TRPBF-1 by Infineon Technologies

Infineon's IRF7805TRPBF-1 is a N-CHANNEL FET with 13A max drain current and 2.5W power dissipation. Ideal for surface mount applications, it operates up to 150°C, making it suitable for high-power electronic circuits in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,321 parts In-Stock

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Digiode

USA . 443 parts In-Stock

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443

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 24,506 parts In-Stock

1+ parts

$1.752

100+ parts

$1.682

1k+ parts

$1.612

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24,506

$1.752

$1.682

$1.612

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AZTECH Wire

Italy . 373 parts In-Stock

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$9.866

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373

$9.866

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Ampacity Inc.

Singapore . 1,170 parts In-Stock

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$47.050

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$47.050

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Corphita

USA . 870 parts In-Stock

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870

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Enhance your electronic designs with the IRF7805TRPBF-1 from Infineon Technologies, a leading manufacturer known for high-quality components. This N-CHANNEL Small Signal Field Effect Transistor offers single configuration and surface mount capability, making it ideal for a variety of applications. With a maximum drain current of 13 A and maximum power dissipation of 2.5 W, this METAL-OXIDE SEMICONDUCTOR technology ensures reliable performance even in demanding environments. Trust Infineon Technologies to deliver exceptional value and efficiency with the IRF7805TRPBF-1.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Allows for efficient current flow in the circuit, making it suitable for various applications where an N-CHANNEL FET is required.

Configuration:

SINGLE - Simple and easy to use in circuits, ideal for applications that require a single FET configuration for performance.

Surface Mount:

YES - Enables easy installation on circuit boards, saving space and providing a clean appearance to the final product.

Maximum Drain Current (Abs) (ID):

13 A - Capable of handling high current loads, making it suitable for applications that require a high level of power.

Maximum Power Dissipation (Abs):

2.5 W - Can handle high power dissipation, ensuring the FET remains within its operating limits for reliable performance.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Provides a reliable and efficient FET technology for better overall performance and stability.

Maximum Operating Temperature:

150 °C - Can operate at high temperatures without degrading performance, making it suitable for various environments with elevated temperatures.

Maximum Drain Current (ID):

13 A - Offers a high maximum drain current, ideal for applications that require a strong and consistent flow of current.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRF7805TRPBF-1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

IRF7805TRPBF-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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