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IPP084N06L3GXKSA1

Infineon Technologies

IPP084N06L3GXKSA1 by Infineon Technologies

Infineon Technologies' IPP084N06L3GXKSA1 is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, 0.0084 ohm RDS(on), and 200A IDM. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 79W.

Median Price

$0.944

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 23,228 parts In-Stock

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$0.927

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$0.769

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$0.686

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$0.686

Verical

USA . 18,000 parts In-Stock

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$0.961

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$0.857

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Farnell

UK . 1,664 parts In-Stock

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$0.840

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1,664

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$0.840

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RS (Exports)

UK . 700 parts In-Stock

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$1.312

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$1.230

700

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$1.230

Distributors (In-Stock)

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Digiode

USA . 49 parts In-Stock

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$0.722

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Chip Stock

USA . 8,503 parts In-Stock

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Vyrian

USA . 3,868 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Ampacity Inc.

Singapore . 1,257 parts In-Stock

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$0.650

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$0.650

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Semicontronic

India . 1,015 parts In-Stock

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$0.650

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$0.634

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$0.630

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1,015

$0.650

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Corphita

USA . 14 parts In-Stock

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$0.684

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Component Stockers USA

USA . 2,332 parts In-Stock

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$0.770

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$0.730

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$0.660

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2,332

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Aztec Data Supply Inc.

USA . 3,491 parts In-Stock

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$1.290

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Corohmni

South Africa . 416 parts In-Stock

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$1.627

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Modulus Dynamics

Lithuania . 21,624 parts In-Stock

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$1.940

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$1.862

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$1.785

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Microchip USA

USA . 158 parts In-Stock

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$4.745

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AZTECH Wire

Italy . 888 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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Argo Parts USA

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Continental Prestige Electronics

USA . 2,364 parts In-Stock

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iodParts Technologies Inc.

India . 400 parts In-Stock

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Bastille Electronics

Australia . 36 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of Infineon Technologies' IPP084N06L3GXKSA1 Power Field Effect Transistor. Designed for switching applications, this N-CHANNEL transistor offers a maximum drain current of 50A and a low on-resistance of 0.0084 ohm, ensuring efficient performance in your projects. With a strong focus on innovation and cutting-edge technology, Infineon Technologies delivers products that exceed industry standards. Trust in the IPP084N06L3GXKSA1 for all your power management needs and experience the benefits of superior design and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body increases durability and thermal performance, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel design allows for efficient switching and current handling, making it suitable for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against voltage spikes, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast operation and high efficiency, making it ideal for power control in various systems.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages, making it suitable for a wide range of power applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into circuit boards, saving space and facilitating efficient layout design.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and ease of installation, making it a convenient choice for manual soldering applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation offers precise control over the switching behavior, allowing for optimized performance in various power management scenarios.

Maximum Pulsed Drain Current (IDM): 200 A

The high maximum pulsed drain current rating of 200A enables efficient handling of peak currents, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 43 mJ

The high avalanche energy rating of 43mJ ensures reliable operation under transient conditions, increasing the robustness of the product.

Maximum Drain Current (Abs) (ID): 50 A

With a maximum drain current rating of 50A, this FET can handle high continuous currents, making it suitable for power switching applications.

No. of Terminals: 3

The FET's three terminals provide flexibility in circuit connections, allowing for versatile use in different electronic systems.

Maximum Power Dissipation (Abs): 79 W

The high maximum power dissipation rating of 79W ensures efficient heat dissipation, enabling continuous operation under high power conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options, providing mechanical stability and ease of installation in various systems.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET offers high performance and reliability, making it a dependable choice for power applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high-temperature environments, ensuring stable operation in demanding conditions.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance and reliability, making this FET a suitable choice for various power applications.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and excellent solderability, ensuring reliable connections and longevity in use.

Maximum Drain Current (ID): 50 A

With a maximum drain current rating of 50A, this FET can handle high current loads, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.0084 ohm

The low drain-source on resistance of 0.0084 ohms minimizes power loss and improves efficiency, making this FET a suitable choice for high-current applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections, ensuring ease of use and installation in various electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) IPP084N06L3GXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

43 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0084 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP084N06L3GXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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