Loading...

IPP039N10N5AKSA1

Infineon Technologies

IPP039N10N5AKSA1 by Infineon Technologies

IPP039N10N5AKSA1 by Infineon is a N-CHANNEL FET with 100V DS Breakdown Voltage, 0.0039 ohm Drain-Source On Resistance, and 400A Pulsed Drain Current. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE.

Median Price

$3.549

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 466 parts In-Stock

1+ parts

$3.480

100+ parts

$2.410

1k+ parts

$1.790

10k+ parts

$1.690

466

$3.480

$2.410

$1.790

$1.690

Farnell

UK . 356 parts In-Stock

1+ parts

$3.510

100+ parts

$2.130

1k+ parts

$1.500

10k+ parts

-

356

$3.510

$2.130

$1.500

-

Arrow

USA . 400 parts In-Stock

1+ parts

$3.549

100+ parts

$1.645

1k+ parts

$1.575

10k+ parts

-

400

$3.549

$1.645

$1.575

-

Element14

Singapore . 110 parts In-Stock

1+ parts

$3.830

100+ parts

$2.515

1k+ parts

$1.969

10k+ parts

-

110

$3.830

$2.515

$1.969

-

Chip1Stop

Japan . 500 parts In-Stock

1+ parts

$4.060

100+ parts

$2.050

1k+ parts

-

10k+ parts

-

500

$4.060

$2.050

-

-

DigiKey

USA . 470 parts In-Stock

1+ parts

$4.190

100+ parts

$1.946

1k+ parts

$1.486

10k+ parts

$1.444

470

$4.190

$1.946

$1.486

$1.444

Newark

USA . 433 parts In-Stock

1+ parts

$4.720

100+ parts

$2.540

1k+ parts

$2.200

10k+ parts

-

433

$4.720

$2.540

$2.200

-

Verical

USA . 43,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.282

10k+ parts

-

43,000

-

-

$2.282

-

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.300

10k+ parts

$1.220

160

-

$1.450

$1.300

$1.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 216 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

-

216

$3.306

-

-

-

Vyrian

USA . 2,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,852

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 5,773 parts In-Stock

1+ parts

$2.771

100+ parts

$2.660

1k+ parts

$2.549

10k+ parts

-

5,773

$2.771

$2.660

$2.549

-

Corphita

USA . 651 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$3.132

-

-

-

Continental Prestige Electronics

USA . 487 parts In-Stock

1+ parts

$3.700

100+ parts

$2.390

1k+ parts

$2.000

10k+ parts

-

487

$3.700

$2.390

$2.000

-

Microchip USA

USA . 7,444 parts In-Stock

1+ parts

$26.000

100+ parts

-

1k+ parts

-

10k+ parts

-

7,444

$26.000

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 6,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,048

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Perfect Parts

USA . 1,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

-

-

-

-

iodParts Technologies Inc.

India . 487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

487

-

-

-

-

Overview

Unleash the power of innovation with the IPP039N10N5AKSA1 by Infineon Technologies, a cutting-edge Power Field Effect Transistor that sets the standard for performance and reliability. Manufactured by industry leader Infineon Technologies, this N-CHANNEL FET offers unparalleled efficiency in switching applications. With a built-in diode and an impressive maximum pulsed drain current of 400A, this transistor is designed to meet the demands of even the most demanding projects. Experience the benefits of enhanced mode operation, high breakdown voltage, and low on-resistance, making it the ideal choice for a wide range of electronic applications. Elevate your designs with the IPP039N10N5AKSA1 and discover a new level of quality and effectiveness in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good insulation and protection for the internal components of the FET, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-state resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse voltage spikes, enhancing the robustness of the FET in power switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting in various electronic devices, providing flexibility in design and installation.

Terminal Form: THROUGH-HOLE

The through-hole terminals simplify the soldering process, ensuring secure connections and reliable performance in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, offering better control over the switching operation and lower power consumption when not in use.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current rating allows this FET to handle short-duration high current spikes, making it suitable for power switching applications with dynamic loads.

Avalanche Energy Rating (EAS): 196 mJ

The high avalanche energy rating indicates the FET's ability to handle energy spikes without damage, ensuring reliability in rugged operating conditions.

No. of Terminals: 3

Having 3 terminals allows for easy integration into existing circuits, simplifying the design process and enabling versatile connectivity options.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options for the FET, reducing the risk of mechanical strain and improving thermal dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low ON-state resistance, and low gate drive requirements, making it ideal for efficient power switching applications.

Transistor Element Material: SILICON

Silicon-based FETs are known for their high temperature tolerance and robust performance, making them suitable for a wide range of operating conditions.

Minimum Operating Temperature: -55 °C

The FET can operate reliably in extreme temperature conditions as low as -55°C, making it suitable for a variety of industrial and automotive applications.

Terminal Finish: TIN

The Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in harsh environments.

Maximum Drain Current (ID): 100 A

With a high drain current rating, this FET can handle high continuous current loads, making it suitable for power switching applications with substantial power requirements.

Maximum Drain-Source On Resistance: 0.0039 ohm

The low ON-state resistance of the FET reduces power losses and improves efficiency in power switching applications, resulting in higher performance and lower heat dissipation.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and allows for easy integration into circuit layouts, enhancing overall design flexibility.

Case Connection: DRAIN

The drain connection is ideal for power switching applications, providing a low-resistance path for current flow and efficient power handling capabilities.

Technical Specifications

Power Field Effect Transistors (FET) IPP039N10N5AKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

196 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP039N10N5AKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20