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IPD60R600E6ATMA1

Infineon Technologies

IPD60R600E6ATMA1 by Infineon Technologies

IPD60R600E6ATMA1 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 19A IDM, 133mJ EAS, and 0.6 ohm RDS(ON). Package: PLASTIC/EPOXY, GULL WING terminals, ENHANCEMENT MODE operation.

Median Price

$1.600

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,988 parts In-Stock

1+ parts

$0.450

100+ parts

$0.440

1k+ parts

$0.430

10k+ parts

-

5,988

$0.450

$0.440

$0.430

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Newark

USA . 385 parts In-Stock

1+ parts

$1.320

100+ parts

$0.866

1k+ parts

$0.604

10k+ parts

-

385

$1.320

$0.866

$0.604

-

Mouser Electronics

USA . 2,494 parts In-Stock

1+ parts

$1.880

100+ parts

$0.795

1k+ parts

$0.570

10k+ parts

$0.518

2,494

$1.880

$0.795

$0.570

$0.518

Element14

Singapore . 385 parts In-Stock

1+ parts

$2.030

100+ parts

$1.340

1k+ parts

$0.928

10k+ parts

$0.824

385

$2.030

$1.340

$0.928

$0.824

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 324 parts In-Stock

1+ parts

$1.282

100+ parts

-

1k+ parts

-

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324

$1.282

-

-

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Vyrian

USA . 298 parts In-Stock

1+ parts

$1.350

100+ parts

-

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-

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298

$1.350

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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-

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 403 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

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403

$1.150

-

-

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Corphita

USA . 947 parts In-Stock

1+ parts

$1.215

100+ parts

-

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-

10k+ parts

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947

$1.215

-

-

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Component Stockers USA

USA . 3,188 parts In-Stock

1+ parts

$1.480

100+ parts

$0.940

1k+ parts

$0.650

10k+ parts

-

3,188

$1.480

$0.940

$0.650

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Modulus Dynamics

Lithuania . 1,438 parts In-Stock

1+ parts

$1.926

100+ parts

$1.849

1k+ parts

$1.772

10k+ parts

-

1,438

$1.926

$1.849

$1.772

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QUARKTWIN TECHNOLOGY LTD

USA . 4,916 parts In-Stock

1+ parts

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4,916

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Microchip USA

USA . 3,438 parts In-Stock

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3,438

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of innovation with the IPD60R600E6ATMA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unmatched reliability and efficiency for switching applications. With a breakthrough design featuring a built-in diode, this transistor delivers seamless performance while maximizing energy savings. Embrace cutting-edge technology and elevate your projects with the superior quality and performance of Infineon products. Experience the difference today and revolutionize your power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to external elements, making the transistor suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are commonly used in switching applications and offer lower on-resistance, making them efficient for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for an external diode, making the transistor a cost-effective choice.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can efficiently control the flow of power in various electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into compact electronic designs.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage ensures reliable operation in applications requiring high voltage switching.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy mounting and compatibility with existing circuit designs.

Terminal Form: GULL WING

The gull wing terminal form facilitates surface mount soldering and ensures a strong mechanical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor's conductivity, providing efficient switching performance.

Maximum Pulsed Drain Current (IDM): 19 A

The high pulsed drain current rating allows the transistor to handle sudden surges in power, ensuring reliable operation in demanding conditions.

Avalanche Energy Rating (EAS): 133 mJ

The high avalanche energy rating means the transistor can withstand transient voltage spikes without damage, ensuring long-term reliability.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit design and reduces the chances of wiring errors.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability in power switching applications.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its stability and efficiency in electronic components.

Terminal Finish: TIN

The tin terminal finish ensures good solderability and electrical conductivity for reliable connection in the circuit.

Maximum Drain-Source On Resistance: 0.6 ohm

The low drain-source on-resistance minimizes power loss and improves efficiency in power switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection process, reducing the chances of errors.

Case Connection: DRAIN

The drain case connection allows for efficient dissipation of heat, ensuring the transistor operates within safe temperature limits.

Technical Specifications

Power Field Effect Transistors (FET) IPD60R600E6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

133 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

19 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD60R600E6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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