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IPD60R950C6ATMA1

Infineon Technologies

IPD60R950C6ATMA1 by Infineon Technologies

IPD60R950C6ATMA1 by Infineon Technologies is a N-CHANNEL power FET with a min DS breakdown voltage of 600V. It is designed for switching applications, offering a max pulsed drain current of 12A and a max drain-source on resistance of 0.95 ohm.

Median Price

$0.634

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 325 parts In-Stock

1+ parts

$0.178

100+ parts

$0.178

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$0.178

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325

$0.178

$0.178

$0.178

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Chip1Stop

Japan . 2,258 parts In-Stock

1+ parts

$0.620

100+ parts

$0.436

1k+ parts

$0.415

10k+ parts

-

2,258

$0.620

$0.436

$0.415

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Farnell

UK . 2,046 parts In-Stock

1+ parts

$1.220

100+ parts

$0.502

1k+ parts

$0.351

10k+ parts

$0.308

2,046

$1.220

$0.502

$0.351

$0.308

DigiKey

USA . 3,984 parts In-Stock

1+ parts

$1.520

100+ parts

$0.639

1k+ parts

$0.457

10k+ parts

$0.364

3,984

$1.520

$0.639

$0.457

$0.364

Mouser Electronics

USA . 1,559 parts In-Stock

1+ parts

$1.900

100+ parts

$0.702

1k+ parts

$0.498

10k+ parts

$0.410

1,559

$1.900

$0.702

$0.498

$0.410

Element14

Singapore . 2,048 parts In-Stock

1+ parts

$2.280

100+ parts

$0.925

1k+ parts

$0.574

10k+ parts

$0.534

2,048

$2.280

$0.925

$0.574

$0.534

Future Electronics

Canada . 95,000 parts In-Stock

1+ parts

-

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-

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$0.415

95,000

-

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-

$0.415

Arrow

USA . 50,000 parts In-Stock

1+ parts

-

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$0.393

50,000

-

-

-

$0.393

Verical

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.648

50,000

-

-

-

$0.648

Rochester

USA . 23,720 parts In-Stock

1+ parts

-

100+ parts

$0.487

1k+ parts

$0.404

10k+ parts

$0.360

23,720

-

$0.487

$0.404

$0.360

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.378

2,500

-

-

-

$0.378

RS (Exports)

UK . 2,485 parts In-Stock

1+ parts

-

100+ parts

$0.932

1k+ parts

$0.512

10k+ parts

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2,485

-

$0.932

$0.512

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Master Electronics

USA . 523 parts In-Stock

1+ parts

-

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523

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 210 parts In-Stock

1+ parts

$0.169

100+ parts

-

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210

$0.169

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Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$0.798

100+ parts

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61

$0.798

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IBS Electronics

USA . 102,500 parts In-Stock

1+ parts

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100+ parts

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$0.603

102,500

-

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$0.603

Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 10,354 parts In-Stock

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10,354

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NAC Semi

USA . 7,500 parts In-Stock

1+ parts

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$1.080

7,500

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$1.080

TME

Poland . 7,500 parts In-Stock

1+ parts

-

100+ parts

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$0.523

7,500

-

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$0.523

Elcom Components

USA . 4,451 parts In-Stock

1+ parts

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4,451

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Rutronik

Germany . 2,500 parts In-Stock

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2,500

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Kruse Electronics AG

Switzerland . 1,614 parts In-Stock

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1,614

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Kruse

Germany . 1,614 parts In-Stock

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1,614

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Martec Srl

Italy . 329 parts In-Stock

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329

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,347 parts In-Stock

1+ parts

$0.151

100+ parts

-

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10,347

$0.151

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Semicontronic

India . 10,177 parts In-Stock

1+ parts

$0.151

100+ parts

$0.147

1k+ parts

$0.146

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10,177

$0.151

$0.147

$0.146

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Corphita

USA . 932 parts In-Stock

1+ parts

$0.160

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932

$0.160

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$0.519

100+ parts

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59

$0.519

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Argo Parts USA

USA . 760 parts In-Stock

1+ parts

$0.766

100+ parts

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760

$0.766

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.782

100+ parts

-

1k+ parts

$0.751

10k+ parts

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100

$0.782

-

$0.751

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Modulus Dynamics

Lithuania . 5,098 parts In-Stock

1+ parts

$1.181

100+ parts

$1.134

1k+ parts

$1.087

10k+ parts

-

5,098

$1.181

$1.134

$1.087

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Aztec Data Supply Inc.

USA . 339 parts In-Stock

1+ parts

$1.643

100+ parts

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339

$1.643

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QUARKTWIN TECHNOLOGY LTD

USA . 17,676 parts In-Stock

1+ parts

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17,676

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Microchip USA

USA . 4,839 parts In-Stock

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4,839

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RC Electronics

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

$0.850

1k+ parts

$0.800

10k+ parts

$0.780

4,500

-

$0.850

$0.800

$0.780

GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

1+ parts

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2,500

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Continental Prestige Electronics

USA . 1,427 parts In-Stock

1+ parts

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100+ parts

$0.706

1k+ parts

$0.479

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1,427

-

$0.706

$0.479

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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500

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Advanced Electronics

New Zealand . 36 parts In-Stock

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36

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Overview

Discover the power of the IPD60R950C6ATMA1 by Infineon Technologies, a high-quality Power Field Effect Transistor (FET) designed to deliver unmatched performance. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Its small outline package shape and gull wing terminal form allow for easy installation. Featuring an impressive minimum DS breakdown voltage of 600V, this transistor ensures reliable operation. Experience enhanced efficiency and reliability with the IPD60R950C6ATMA1. Upgrade your systems and unlock new possibilities today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY. This material ensures durability and reliability, making it a good choice for various applications.

Polarity or Channel Type

N-CHANNEL. The N-channel configuration allows for efficient and fast switching, making it suitable for high-performance applications.

Configuration

SINGLE WITH BUILT-IN DIODE. The built-in diode simplifies circuit design and provides reverse current protection, making it convenient for use in various switching applications.

Transistor Application

SWITCHING. Designed specifically for switching purposes, this product provides high efficiency and low power consumption, making it ideal for energy-saving applications.

Surface Mount

YES. The surface mount capability enables easy installation and space-saving on PCBs, making it convenient for compact electronic designs.

Minimum DS Breakdown Voltage

600 V. With a high breakdown voltage, this product ensures reliable performance and protection against voltage surges, making it suitable for demanding applications.

Package Shape

RECTANGULAR. The rectangular shape allows for straightforward and efficient PCB integration, making it a practical choice for space-constrained designs.

Terminal Form

GULL WING. The gull wing terminal form enhances stability and provides a robust connection, ensuring reliable operation under various conditions.

Operating Mode

ENHANCEMENT MODE. The enhancement mode operation enables precise and controlled switching, making it suitable for applications that require accurate performance.

No. of Elements

1. With a single element, this product offers simplicity and ease of use in circuit designs, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM)

12 A. The high maximum pulsed drain current allows for efficient switching performance, making it suitable for applications that require high-power handling.

Avalanche Energy Rating (EAS)

46 mJ. With a high avalanche energy rating, this product ensures reliable and stable operation, making it ideal for applications that involve transient voltage conditions.

No. of Terminals

2. With only two terminals, this product offers simplicity in circuit integration and reduces complexity in system design, making it a preferred choice for various applications.

Package Style (Meter)

SMALL OUTLINE. The small outline package style offers space-saving advantages and ease of integration, making it suitable for compact and portable electronic devices.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR. The metal-oxide semiconductor technology provides excellent performance and reliability, making it a reliable choice for various applications.

Transistor Element Material

SILICON. Made from silicon, this product offers high durability and temperature resistance, making it suitable for demanding operating conditions.

Terminal Finish

TIN. The tin terminal finish ensures good solderability and corrosion resistance, making it a reliable choice for long-lasting connections.

Maximum Drain Current (ID)

4.4 A. With a high maximum drain current, this product can handle substantial power, making it suitable for applications requiring high-current switching.

Maximum Drain-Source On Resistance

0.95 ohm. The low drain-source on resistance minimizes power loss and improves overall efficiency, making it a preferred choice for low-power applications.

Terminal Position

SINGLE. With a single terminal position, this product offers simplicity and ease of use in circuit designs, making it suitable for various applications.

Moisture Sensitivity Level (MSL)

1. The moisture sensitivity level of 1 indicates that this product has the highest level of moisture resistance, ensuring reliable operation even in humid environments.

Case Connection

DRAIN. The drain case connection enhances thermal dissipation and provides better heat management, ensuring stable and efficient performance, making it a reliable choice for applications requiring heat dissipation.

Technical Specifications

Power Field Effect Transistors (FET) IPD60R950C6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

46 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

4.4 A

Maximum Drain-Source On Resistance:

.95 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

12 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD60R950C6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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