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IPD60R2K0C6ATMA1

Infineon Technologies

IPD60R2K0C6ATMA1 by Infineon Technologies

IPD60R2K0C6ATMA1 by Infineon is a N-CHANNEL FET with 600V DS Breakdown Voltage and 6A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 2 ohm RDS(on), and 11mJ EAS rating. The PLASTIC/EPOXY package with GULL WING terminals is surface mountable in ENHANCEMENT MODE configuration.

Median Price

$0.304

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11 parts In-Stock

1+ parts

$0.284

100+ parts

$0.267

1k+ parts

$0.242

10k+ parts

-

11

$0.284

$0.267

$0.242

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Mouser Electronics

USA . 2,839 parts In-Stock

1+ parts

$1.210

100+ parts

$0.499

1k+ parts

$0.350

10k+ parts

$0.276

2,839

$1.210

$0.499

$0.350

$0.276

DigiKey

USA . 2,490 parts In-Stock

1+ parts

$1.460

100+ parts

$0.602

1k+ parts

$0.424

10k+ parts

-

2,490

$1.460

$0.602

$0.424

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Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$0.304

5,000

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$0.304

Verical

USA . 2,500 parts In-Stock

1+ parts

-

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$0.271

2,500

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$0.271

Distributors (In-Stock)

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Digiode

USA . 57 parts In-Stock

1+ parts

$0.270

100+ parts

-

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57

$0.270

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Nova Conductors

Japan . 53 parts In-Stock

1+ parts

$0.489

100+ parts

-

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53

$0.489

-

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Rutronik

Germany . 7,500 parts In-Stock

1+ parts

-

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7,500

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Chip Stock

USA . 5,300 parts In-Stock

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5,300

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Vyrian

USA . 3,293 parts In-Stock

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3,293

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,091 parts In-Stock

1+ parts

$0.241

100+ parts

-

1k+ parts

-

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3,091

$0.241

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Semicontronic

India . 2,149 parts In-Stock

1+ parts

$0.241

100+ parts

$0.235

1k+ parts

$0.234

10k+ parts

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2,149

$0.241

$0.235

$0.234

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Corphita

USA . 900 parts In-Stock

1+ parts

$0.256

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900

$0.256

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Argo Parts USA

USA . 2,345 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

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10k+ parts

$0.474

2,345

$0.489

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-

$0.474

Continental Prestige Electronics

USA . 1,265 parts In-Stock

1+ parts

$0.489

100+ parts

-

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10k+ parts

$0.479

1,265

$0.489

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-

$0.479

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$0.499

100+ parts

$0.499

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$0.499

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60

$0.499

$0.499

$0.499

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Modulus Dynamics

Lithuania . 603 parts In-Stock

1+ parts

$0.521

100+ parts

$0.500

1k+ parts

$0.479

10k+ parts

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603

$0.521

$0.500

$0.479

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Corohmni

South Africa . 27 parts In-Stock

1+ parts

$0.521

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27

$0.521

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Aztec Data Supply Inc.

USA . 4,017 parts In-Stock

1+ parts

$0.814

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4,017

$0.814

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Component Stockers USA

USA . 15,829 parts In-Stock

1+ parts

$0.860

100+ parts

$0.520

1k+ parts

$0.370

10k+ parts

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15,829

$0.860

$0.520

$0.370

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Infinite Electronics LLP (Excess)

. 7,001 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,739 parts In-Stock

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3,739

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$0.479

1k+ parts

$0.465

10k+ parts

$0.455

1,000

-

$0.479

$0.465

$0.455

Overview

Elevate your power switching capabilities with the IPD60R2K0C6ATMA1 by Infineon Technologies. This high-quality N-CHANNEL Power FET offers unparalleled performance in a compact, surface-mount package. With a minimum DS Breakdown Voltage of 600V and a Maximum Pulsed Drain Current of 6A, this transistor is perfect for various switching applications. Infineon's expertise in semiconductor technology ensures reliability and efficiency, making this FET a valuable addition to your electronic projects. Unlock the potential of your designs with the IPD60R2K0C6ATMA1 and experience the difference that quality components can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the transistor, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs have better performance and efficiency compared to P-Channel FETs, making this transistor a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection and helps increase efficiency in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in this use case.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage ensures reliable operation in high voltage applications, making it a versatile choice.

Maximum Pulsed Drain Current (IDM): 6 A

Capable of handling high current pulses, suitable for applications requiring transient current spikes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, ideal for various applications.

Maximum Drain-Source On Resistance: 2 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPD60R2K0C6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

11 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

6 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD60R2K0C6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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