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IPD65R600E6ATMA1

Infineon Technologies

IPD65R600E6ATMA1 by Infineon Technologies

Infineon's IPD65R600E6ATMA1 is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. It features a max pulsed drain current of 18A and 0.6 ohm RDS(on). Operating in enhancement mode, it has an EAS of 142mJ and can withstand temperatures from -55 to 150 °C.

Median Price

$0.994

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 2,516 parts In-Stock

1+ parts

$2.380

100+ parts

$1.600

1k+ parts

$1.140

10k+ parts

$1.070

2,516

$2.380

$1.600

$1.140

$1.070

Rochester

USA . 101,758 parts In-Stock

1+ parts

-

100+ parts

$0.958

1k+ parts

$0.795

10k+ parts

$0.709

101,758

-

$0.958

$0.795

$0.709

Verical

USA . 56,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.994

10k+ parts

$0.886

56,800

-

-

$0.994

$0.886

Farnell

UK . 2,466 parts In-Stock

1+ parts

-

100+ parts

$0.779

1k+ parts

$0.564

10k+ parts

-

2,466

-

$0.779

$0.564

-

Chip1Stop

Japan . 2,446 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.000

10k+ parts

-

2,446

-

$1.270

$1.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 943 parts In-Stock

1+ parts

$0.746

100+ parts

-

1k+ parts

-

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943

$0.746

-

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Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$0.813

100+ parts

-

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77

$0.813

-

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Vyrian

USA . 4,341 parts In-Stock

1+ parts

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4,341

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 14,260 parts In-Stock

1+ parts

$0.406

100+ parts

$0.396

1k+ parts

$0.394

10k+ parts

-

14,260

$0.406

$0.396

$0.394

-

Ampacity Inc.

Singapore . 14,072 parts In-Stock

1+ parts

$0.406

100+ parts

-

1k+ parts

-

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-

14,072

$0.406

-

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Continental Prestige Electronics

USA . 2,564 parts In-Stock

1+ parts

$0.447

100+ parts

-

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2,564

$0.447

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Aztec Data Supply Inc.

USA . 2,141 parts In-Stock

1+ parts

$0.640

100+ parts

-

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2,141

$0.640

-

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Corphita

USA . 715 parts In-Stock

1+ parts

$0.706

100+ parts

-

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715

$0.706

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.797

100+ parts

-

1k+ parts

$0.765

10k+ parts

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1,000

$0.797

-

$0.765

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Argo Parts USA

USA . 4,009 parts In-Stock

1+ parts

$0.813

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4,009

$0.813

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Modulus Dynamics

Lithuania . 2,126 parts In-Stock

1+ parts

$0.888

100+ parts

$0.852

1k+ parts

$0.817

10k+ parts

-

2,126

$0.888

$0.852

$0.817

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Corohmni

South Africa . 5 parts In-Stock

1+ parts

$0.888

100+ parts

-

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5

$0.888

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AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$8.720

100+ parts

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437

$8.720

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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GreenTree Electronics

Israel . 2,446 parts In-Stock

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2,446

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Microchip USA

USA . 131 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the IPD65R600E6ATMA1 by Infineon Technologies. As a leader in Power Field Effect Transistors (FET), Infineon delivers top-notch quality and performance for switching applications. With a minimum DS breakdown voltage of 650V and maximum pulsed drain current of 18A, this N-CHANNEL transistor offers unparalleled value and benefits. Whether you're looking to optimize your power management system or enhance your electronic devices, the IPD65R600E6ATMA1 is the perfect solution for all your needs. Choose excellence, choose Infineon.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher electron mobility, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, making this FET suitable for switching applications where backflow of current needs to be prevented.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Allows for easy and compact integration onto circuit boards, saving space and reducing assembly complexity.

Minimum DS Breakdown Voltage: 650 V

Can handle high voltage levels, making it suitable for applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and alignment on the circuit board.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connection and are suitable for automated soldering processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer higher input impedance and lower leakage current, resulting in better performance.

Maximum Pulsed Drain Current (IDM): 18 A

Can handle high current spikes without damage, making it suitable for power applications.

Avalanche Energy Rating (EAS): 142 mJ

Can withstand energy spikes during avalanche breakdown, providing protection against voltage surges.

No. of Terminals: 2

Simplified design with only 2 terminals for easy integration into circuits.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the circuit board, allowing for more components to be placed in a limited area.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low ON resistance, high switching speed, and low power consumption.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its stability and reliability.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold environments, ensuring functionality in various conditions.

Terminal Finish: TIN

Tin finish provides good solderability, ensuring reliable connections.

Maximum Drain-Source On Resistance: 0.6 ohm

Low ON resistance reduces power losses and improves efficiency in switching operations.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and layout.

Case Connection: DRAIN

Drain connection allows for easy heat dissipation, ensuring optimal performance under high power conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPD65R600E6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

142 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD65R600E6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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