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IPD320N20N3GXT

Infineon Technologies

IPD320N20N3GXT by Infineon Technologies

IPD320N20N3GXT by Infineon is a N-CHANNEL FET with 200V DS Breakdown Voltage, 136A IDM, and 0.032 ohm RDS(on). It is used for SWITCHING applications in ENHANCEMENT MODE at up to 175°C.

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3

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< 1k

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Vyrian

USA . 632 parts In-Stock

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Digiode

USA . 174 parts In-Stock

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Nova Conductors

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Aztec Data Supply Inc.

USA . 24,379 parts In-Stock

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$0.630

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Corohmni

South Africa . 840 parts In-Stock

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$1.136

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840

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Modulus Dynamics

Lithuania . 386 parts In-Stock

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$1.825

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$1.752

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$1.679

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386

$1.825

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AZTECH Wire

Italy . 812 parts In-Stock

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$7.888

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Ampacity Inc.

Singapore . 1,138 parts In-Stock

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$40.050

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Continental Prestige Electronics

USA . 2,673 parts In-Stock

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Argo Parts USA

USA . 1,283 parts In-Stock

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Corphita

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Bastille Electronics

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Overview

Unleash the power of innovation with the IPD320N20N3GXT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Power Field Effect Transistors (FET) that are designed for switching applications. With a maximum pulsed drain current of 136A and a minimum DS breakdown voltage of 200V, this N-channel transistor offers unparalleled performance and reliability. Whether you're looking to enhance your electronic devices or streamline your power management systems, the IPD320N20N3GXT provides the efficiency and precision you need. Elevate your technology with the Infineon advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Polarity or Channel Type: N-CHANNEL

Allows for efficient control and switching of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance.

Surface Mount: YES

Enables easy and secure mounting on a PCB.

Minimum DS Breakdown Voltage: 200 V

Provides a high level of protection against voltage spikes.

Package Shape: RECTANGULAR

Facilitates easy packaging and integration into electronic devices.

Terminal Form: GULL WING

Offers a secure and reliable connection during soldering.

Operating Mode: ENHANCEMENT MODE

Allows for easy and efficient control of the transistor.

Maximum Pulsed Drain Current (IDM): 136 A

Capable of handling high current pulses for demanding applications.

Avalanche Energy Rating (EAS): 190 mJ

Provides protection against voltage spikes and transient events.

No. of Terminals: 2

Simplifies circuit connectivity and integration.

Package Style (Meter): SMALL OUTLINE

Optimizes space usage on the circuit board.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and reliability for switching applications.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Provides high efficiency and performance for the transistor.

Maximum Drain Current (ID): 34 A

Capable of handling high continuous current flow.

Maximum Drain-Source On Resistance: 0.032 ohm

Provides low resistance for efficient current flow.

Terminal Position: SINGLE

Simplifies circuit design and connectivity.

Case Connection: DRAIN

Ensures efficient heat dissipation during operation.

Technical Specifications

Power Field Effect Transistors (FET) IPD320N20N3GXT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

190 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

136 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD320N20N3GXT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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