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IPD30N08S2L21XT

Infineon Technologies

IPD30N08S2L21XT by Infineon Technologies

Infineon's IPD30N08S2L21XT is a N-CHANNEL FET with 75V DS Breakdown Voltage, 30A ID, and 0.026 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$0.708

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 2,500 parts In-Stock

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Vyrian

USA . 2,250 parts In-Stock

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Digiode

USA . 599 parts In-Stock

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599

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Ampacity Inc.

Singapore . 2,030 parts In-Stock

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$0.600

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$0.600

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Modulus Dynamics

Lithuania . 17,564 parts In-Stock

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$0.997

100+ parts

$0.957

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$0.917

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17,564

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$0.957

$0.917

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Continental Prestige Electronics

USA . 5,883 parts In-Stock

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Argo Parts USA

USA . 805 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Corphita

USA . 111 parts In-Stock

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Overview

Unleash the power of innovation with the IPD30N08S2L21XT by Infineon Technologies. Crafted with precision and expertise, this Power FET offers unparalleled performance and reliability in a compact package. Whether you're looking to enhance your automotive systems, industrial controls, or renewable energy applications, this N-channel transistor with built-in diode is designed to exceed expectations. Experience seamless operation and efficiency with Infineon's cutting-edge technology, setting new standards in the industry. Elevate your projects with the IPD30N08S2L21XT and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the FET durable and resistant to external elements, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high efficiency and faster switching speeds, making them ideal for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects the FET from reverse voltage, enhancing its reliability.

Surface Mount: YES

The surface mount capability allows for easy installation on printed circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 75 V

The high minimum breakdown voltage ensures reliable and safe operation in high voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used in electronic devices, offering compatibility and ease of integration.

Max Pulsed Drain Current (IDM): 120 A

The high pulsed drain current rating allows the FET to handle heavy loads and sudden spikes in current without overheating.

Avalanche Energy Rating (EAS): 240 mJ

The high avalanche energy rating indicates the FET's ability to withstand high energy spikes, making it suitable for rugged environments.

No. of Terminals: 2

Having only two terminals simplifies circuit connections and reduces the risk of wiring errors.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact designs in power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, ensuring efficient power management in various applications.

Transistor Element Material: SILICON

Silicon transistors are known for their high efficiency, low cost, and high temperature tolerance, making them a popular choice in power electronics.

Max Drain Current (ID): 30 A

The high maximum drain current rating allows the FET to handle large power loads without damage, ensuring reliable operation.

Max Drain-Source On Resistance: 0.026 ohm

The low drain-source on resistance minimizes power loss and heat generation, improving overall efficiency.

Terminal Position: SINGLE

The single terminal position simplifies circuit layout and reduces the risk of wiring errors during installation.

Case Connection: DRAIN

The case connection at the drain terminal simplifies circuit design and enhances overall reliability.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures that the FET meets strict automotive quality requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) IPD30N08S2L21XT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

240 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPD30N08S2L21XT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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