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IPB180N04S401ATMA1

Infineon Technologies

IPB180N04S401ATMA1 by Infineon Technologies

Infineon's IPB180N04S401ATMA1 is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 0.0013 ohm RDS(ON). Ideal for automotive applications due to AEC-Q101 standard compliance, it features 720A IDM and 550mJ EAS.

Median Price

$3.100

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,123 parts In-Stock

1+ parts

$3.100

100+ parts

$1.420

1k+ parts

$1.160

10k+ parts

-

1,123

$3.100

$1.420

$1.160

-

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$3.640

100+ parts

$2.360

1k+ parts

-

10k+ parts

-

1,000

$3.640

$2.360

-

-

DigiKey

USA . 820 parts In-Stock

1+ parts

$4.010

100+ parts

$1.834

1k+ parts

$1.224

10k+ parts

$1.195

820

$4.010

$1.834

$1.224

$1.195

Element14

Singapore . 1,221 parts In-Stock

1+ parts

$5.290

100+ parts

$3.400

1k+ parts

$2.730

10k+ parts

-

1,221

$5.290

$3.400

$2.730

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.337

10k+ parts

$1.262

2,000

-

-

$1.337

$1.262

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$1.070

10k+ parts

$1.010

2,000

-

$1.200

$1.070

$1.010

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.219

10k+ parts

$1.192

1,000

-

-

$1.219

$1.192

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 300 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$1.264

-

-

-

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$2.234

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$2.234

-

-

-

IBS Electronics

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.081

10k+ parts

$4.025

7,000

-

-

$4.081

$4.025

Vyrian

USA . 3,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,076

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 215 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$1.197

-

-

-

Ampacity Inc.

Singapore . 1,327 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$1.520

-

-

-

Modulus Dynamics

Lithuania . 15,589 parts In-Stock

1+ parts

$1.701

100+ parts

$1.633

1k+ parts

$1.565

10k+ parts

-

15,589

$1.701

$1.633

$1.565

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$2.234

100+ parts

-

1k+ parts

$2.122

10k+ parts

$2.078

500

$2.234

-

$2.122

$2.078

Continental Prestige Electronics

USA . 600 parts In-Stock

1+ parts

$2.820

100+ parts

$2.070

1k+ parts

$1.730

10k+ parts

-

600

$2.820

$2.070

$1.730

-

Microchip USA

USA . 4,678 parts In-Stock

1+ parts

$13.939

100+ parts

-

1k+ parts

-

10k+ parts

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4,678

$13.939

-

-

-

GreenTree Electronics

Israel . 100,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100,000

-

-

-

-

Overview

Unlock the power of innovation with the Infineon Technologies IPB180N04S401ATMA1 Power Field Effect Transistor. Crafted with precision and expertise, this N-CHANNEL transistor offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial, this transistor's built-in diode and enhancement mode operation ensure seamless functionality. With a maximum drain current of 180A and a low on-resistance of 0.0013 ohm, this transistor delivers exceptional value and efficiency. Trust in Infineon Technologies to elevate your projects to new heights with the IPB180N04S401ATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FET lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient current flow, making this FET ideal for high-performance electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage, enhancing the reliability of the system.

Surface Mount: YES

The surface mount capability saves space on the PCB and streamlines the production process, making this FET a cost-effective choice.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle high voltage applications with ease, ensuring reliable performance.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing circuit layouts, making this FET versatile and user-friendly.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easy soldering, enhancing the overall durability of the FET.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation offers precise control over the FET's conductivity, making it suitable for a wide range of power management applications.

Maximum Pulsed Drain Current (IDM): 720 A

With a maximum pulsed drain current of 720A, this FET can handle high power loads efficiently, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 550 mJ

The high avalanche energy rating of 550mJ ensures the FET can withstand transient voltage spikes, enhancing system reliability.

No. of Terminals: 6

With 6 terminals, this FET offers versatile connectivity options, allowing for easy integration into complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making this FET suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high reliability and efficiency, making this FET a reliable choice for power management applications.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures low power loss and high switching speeds, enhancing overall performance.

Terminal Finish: TIN

The tin terminal finish provides excellent corrosion resistance and solderability, ensuring long-term reliability of the FET.

Maximum Drain Current (ID): 180 A

With a maximum drain current of 180A, this FET can handle high power loads effectively, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.0013 ohm

The low drain-source on resistance minimizes power loss and heat generation, enhancing the efficiency of the FET.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of error, making this FET user-friendly and suitable for mass production.

Case Connection: DRAIN

The drain case connection simplifies circuit design and improves heat dissipation, ensuring reliable operation in high-power applications.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 standard, this FET meets rigorous automotive quality requirements, making it a reliable choice for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB180N04S401ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

550 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

720 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB180N04S401ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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