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IPB100N04S204ATMA4

Infineon Technologies

IPB100N04S204ATMA4 by Infineon Technologies

Infineon's IPB100N04S204ATMA4 is a N-CHANNEL FET with 40V DS Breakdown Voltage, 400A IDM, and 0.0033 ohm RDS(ON). Ideal for power applications due to its 810mJ EAS rating. Features GULL WING terminals in a RECTANGULAR package shape.

Median Price

$1.708

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,483 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

$1.340

10k+ parts

$1.260

16,483

-

$1.500

$1.340

$1.260

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.675

10k+ parts

$1.575

10,000

-

-

$1.675

$1.575

RS (Exports)

UK . 5,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.185

10k+ parts

-

5,985

-

-

$2.185

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.740

10k+ parts

-

1,000

-

-

$1.740

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 732 parts In-Stock

1+ parts

$1.586

100+ parts

-

1k+ parts

-

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732

$1.586

-

-

-

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$3.300

100+ parts

-

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-

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29

$3.300

-

-

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Vyrian

USA . 7,851 parts In-Stock

1+ parts

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7,851

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 926 parts In-Stock

1+ parts

$1.503

100+ parts

-

1k+ parts

-

10k+ parts

-

926

$1.503

-

-

-

Modulus Dynamics

Lithuania . 23,931 parts In-Stock

1+ parts

$2.222

100+ parts

$2.133

1k+ parts

$2.044

10k+ parts

-

23,931

$2.222

$2.133

$2.044

-

Ampacity Inc.

Singapore . 7,998 parts In-Stock

1+ parts

$3.090

100+ parts

-

1k+ parts

-

10k+ parts

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7,998

$3.090

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$3.234

100+ parts

-

1k+ parts

$3.105

10k+ parts

-

500

$3.234

-

$3.105

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Allen Electronics Distributors

USA . 5,985 parts In-Stock

1+ parts

$5.906

100+ parts

$5.366

1k+ parts

-

10k+ parts

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5,985

$5.906

$5.366

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Microchip USA

USA . 7,216 parts In-Stock

1+ parts

$25.714

100+ parts

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10k+ parts

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7,216

$25.714

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RC Electronics

USA . 45,064 parts In-Stock

1+ parts

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100+ parts

$2.260

1k+ parts

$2.070

10k+ parts

$2.010

45,064

-

$2.260

$2.070

$2.010

Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

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100+ parts

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5,600

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Overview

Unlock the power of cutting-edge technology with the IPB100N04S204ATMA4 from Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Power Field Effect Transistors for a wide range of applications. With its N-CHANNEL design and built-in diode, this transistor offers unmatched performance and reliability. Experience enhanced efficiency and superior functionality with Infineon's latest innovation. Trust Infineon to provide the best-in-class solutions for all your power needs. Elevate your projects with the IPB100N04S204ATMA4 and see the difference Infineon can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers good durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower resistance and higher efficiency compared to P-channel FETs, making them a good choice for many power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making the overall system more compact and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto printed circuit boards, saving assembly time and cost.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage rating ensures reliable operation and protection against voltage spikes or fluctuations in the circuit.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly, providing good mechanical stability.

Terminal Form: GULL WING

Gull wing terminals offer secure and reliable connections to the circuit board, ensuring good electrical performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily controlled and are generally more efficient in switching applications.

Maximum Pulsed Drain Current (IDM): 400 A

High pulsed drain current capability allows for handling short duration high current spikes without damage or performance degradation.

Avalanche Energy Rating (EAS): 810 mJ

High avalanche energy rating indicates the ability to withstand high energy spikes, providing robustness in demanding applications.

No. of Terminals: 2

Having only two terminals simplifies circuit connections and reduces the risk of errors in installation or operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for denser layouts in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low power consumption, ideal for efficient power management.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability, temperature stability, and compatibility with various fabrication processes.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in different operating environments.

Maximum Drain Current (ID): 100 A

High maximum drain current rating allows for handling large continuous currents without overheating or performance degradation.

Maximum Drain-Source On Resistance: 0.0033 ohm

Low drain-source on resistance minimizes power losses and heat generation, maximizing efficiency in power applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and connections, reducing the chances of errors during assembly or maintenance.

Case Connection: DRAIN

The drain case connection provides good thermal dissipation and helps in keeping the transistor temperature within safe limits during operation.

Technical Specifications

Power Field Effect Transistors (FET) IPB100N04S204ATMA4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

810 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0033 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB100N04S204ATMA4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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