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IKP15N60T

Infineon Technologies

IKP15N60T by Infineon Technologies

IKP15N60T by Infineon Technologies is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 30A max collector current, and 130W max power dissipation. Ideal for power control applications due to its single configuration with built-in diode and fast turn-off time of 291ns. Package style is flange mount with through-hole terminals.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$2.320

100+ parts

$1.150

1k+ parts

$0.803

10k+ parts

$0.761

5

$2.320

$1.150

$0.803

$0.761

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 96 parts In-Stock

1+ parts

$0.893

100+ parts

-

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96

$0.893

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Vyrian

USA . 455 parts In-Stock

1+ parts

$0.940

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-

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455

$0.940

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Rutronik

Germany . 2,350 parts In-Stock

1+ parts

-

100+ parts

$1.250

1k+ parts

$1.140

10k+ parts

-

2,350

-

$1.250

$1.140

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

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650

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Rebound Electronics

UK . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 855 parts In-Stock

1+ parts

$0.800

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-

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855

$0.800

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Corphita

USA . 168 parts In-Stock

1+ parts

$0.846

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168

$0.846

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Modulus Dynamics

Lithuania . 601 parts In-Stock

1+ parts

$1.952

100+ parts

$1.874

1k+ parts

$1.796

10k+ parts

-

601

$1.952

$1.874

$1.796

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Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$23.400

100+ parts

-

1k+ parts

$16.382

10k+ parts

$16.382

1,000

$23.400

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$16.382

$16.382

Perfect Parts

USA . 28,224 parts In-Stock

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28,224

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Infinite Electronics LLP (Excess)

. 3,509 parts In-Stock

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3,509

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A-Z Elektronik GmbH

Germany . 1,703 parts In-Stock

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1,703

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Alle Elektronik GmbH

Germany . 1,135 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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500

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Overview

Infineon Ultrafast 600V Trench IGBTs are rugged, reliable Insulated Gate Bipolar Transistors optimized for Uninterruptible Power Supplies (UPS), solar, industrial motor, and welding applications. These Ultrafast 600V Trench IGBTs utilize Trench thin wafer technology to offer lower conduction and switching losses. Infineon Ultrafast 600V Trench IGBTs are co-packaged with a soft recovery low Qrr diode. These devices are ideal for ultra-fast switching (8KHz to 30KHz) applications with 5µs short circuit rating. They feature low Vce(on) and positive Vce(on) temperature coefficient for easy paralleling.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, increasing the lifespan of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have better performance and efficiency compared to P-channel IGBTs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this IGBT a convenient choice for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable and efficient performance.

Terminal Form: THROUGH-HOLE

Allows for easy installation and secure connections on a circuit board.

Maximum Power Dissipation (Abs): 130 W

Capable of handling high power levels without overheating, ensuring stable operation.

Maximum Collector-Emitter Voltage: 600 V

Suitable for high voltage applications, providing a wide range of potential uses.

Maximum Collector Current (IC): 30 A

Supports high current loads, making it suitable for power control applications that require large amounts of current.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance, ensuring reliable connections.

Nominal Turn On Time (ton): 32 ns

Fast turn-on time allows for quick switching and efficient power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKP15N60T attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

HIGH SPEED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

291 ns

Nominal Turn On Time (ton):

32 ns

Trade Compliance

IKP15N60T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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