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IKP10N60T

Infineon Technologies

IKP10N60T by Infineon Technologies

IKP10N60T by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max gate-emitter voltage of 20V. It has a nominal turn-off time of 296ns and is designed for power control applications, offering a max power dissipation of 110W.

Median Price

$3.165

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 234 parts In-Stock

1+ parts

$1.930

100+ parts

$0.853

1k+ parts

$0.603

10k+ parts

$0.574

234

$1.930

$0.853

$0.603

$0.574

Chip1Stop

Japan . 55 parts In-Stock

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$4.400

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$4.400

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Distributors (In-Stock)

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Digiode

USA . 174 parts In-Stock

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$1.596

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174

$1.596

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Vyrian

USA . 924 parts In-Stock

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$1.680

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924

$1.680

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TME

Poland . 31 parts In-Stock

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$1.740

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$1.360

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31

$1.740

$1.360

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ComSIT Distribution GmbH

Germany . 1,100 parts In-Stock

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1,100

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Rutronik

Germany . 500 parts In-Stock

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$0.958

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$0.847

500

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$0.958

$0.847

Cyclops Electronics Ltd

UK . 18 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 13,547 parts In-Stock

1+ parts

$1.152

100+ parts

$1.106

1k+ parts

$1.060

10k+ parts

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13,547

$1.152

$1.106

$1.060

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Corphita

USA . 15 parts In-Stock

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$1.512

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15

$1.512

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Andel Nordic

Denmark . 1,200 parts In-Stock

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$45.060

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$31.545

10k+ parts

$31.545

1,200

$45.060

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$31.545

$31.545

Perfect Parts

USA . 6,539 parts In-Stock

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6,539

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Overview

Infineon 300-1200V IGBTs have an extensive portfolio of IGBTs that achieves the highest performance for specific application requirements. The Infineon IGBT portfolio includes the new ultra-fast IRG7PH 1200V Trench IGBTs that offer higher system efficiency while cutting switching losses and delivering higher switching frequencies. Infineon IRG7PH ultra-fast 1200V IGBTs utilize thin wafer Field-Stop Trench technology that significantly reduces switching and conduction losses to deliver higher power density and greater efficiency at higher frequencies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Optimal for power control applications, offering efficiency and control over current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor, saving space and enhancing functionality.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring efficient and effective performance.

Package Shape: RECTANGULAR

Provides a compact and efficient design, suitable for various installations and applications.

Nominal Turn Off Time (toff): 296 ns

Fast turn-off time enables quick switching and control, enhancing overall performance.

Maximum Power Dissipation: 110 W

Ability to dissipate high power allows for handling demanding tasks and operating conditions.

Maximum Operating Temperature: 175 °C

Can withstand high temperatures, ensuring stable operation in challenging environments.

Maximum Collector-Emitter Voltage: 600 V

Provides a high voltage rating, making it suitable for applications requiring high voltage handling.

Maximum Gate-Emitter Voltage: 20 V

Designed to handle gate-emitter voltages efficiently, enhancing control and performance.

Maximum Collector Current (IC): 20 A

Capable of handling high collector currents, making it suitable for power control applications.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Optimal threshold voltage for gate control, ensuring precise operation and control.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance, enhancing the reliability and longevity of the terminals.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKP10N60T attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

296 ns

Nominal Turn On Time (ton):

21 ns

Trade Compliance

IKP10N60T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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