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IKB03N120H2ATMA1

Infineon Technologies

IKB03N120H2ATMA1 by Infineon Technologies

Infineon's IKB03N120H2ATMA1 is an N-CHANNEL IGBT with 1200V VCE, 9.6A IC, and 403ns toff. Ideal for power control applications, it features a built-in diode in a small outline package for surface mount assembly.

Median Price

$1.526

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 411 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.290

10k+ parts

$1.220

411

-

$1.440

$1.290

$1.220

Verical

USA . 411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.613

10k+ parts

$1.525

411

-

-

$1.613

$1.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$2.020

100+ parts

-

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600

$2.020

-

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Vyrian

USA . 1,959 parts In-Stock

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1,959

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Chip Stock

USA . 1,109 parts In-Stock

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1,109

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Digiode

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 175 parts In-Stock

1+ parts

$1.550

100+ parts

-

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175

$1.550

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Modulus Dynamics

Lithuania . 24,880 parts In-Stock

1+ parts

$1.594

100+ parts

$1.530

1k+ parts

$1.466

10k+ parts

-

24,880

$1.594

$1.530

$1.466

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Corohmni

South Africa . 206 parts In-Stock

1+ parts

$1.735

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206

$1.735

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AZTECH Wire

Italy . 399 parts In-Stock

1+ parts

$7.668

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399

$7.668

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Microchip USA

USA . 6,566 parts In-Stock

1+ parts

$13.195

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6,566

$13.195

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Ampacity Inc.

Singapore . 226 parts In-Stock

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$41.050

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226

$41.050

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QUARKTWIN TECHNOLOGY LTD

USA . 12,489 parts In-Stock

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12,489

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Continental Prestige Electronics

USA . 5,244 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Argo Parts USA

USA . 1,122 parts In-Stock

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1,122

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 487 parts In-Stock

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487

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$1.980

1k+ parts

$1.919

10k+ parts

$1.879

100

-

$1.980

$1.919

$1.879

Overview

Unleash the power of innovation with the IKB03N120H2ATMA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors that are designed to excel in power control applications. With a single configuration and built-in diode, this N-channel transistor offers unparalleled performance and reliability. Whether you're looking to optimize power efficiency or enhance system stability, the IKB03N120H2ATMA1 provides the value, benefits, and advantages you need to stay ahead of the competition. Elevate your projects with the cutting-edge technology of Infineon Technologies.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides good insulation and durability, making it ideal for power control applications.

Polarity or Channel Type:

N-CHANNEL - Allows for efficient power control in single-channel configurations.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and improves performance with integrated diode.

Transistor Application:

POWER CONTROL - Specifically designed for power control applications, ensuring reliable operation.

Surface Mount:

YES - Easy to mount on PCBs, saving space and facilitating automated assembly processes.

Package Shape:

RECTANGULAR - Compact shape fits well in electronic devices, maximizing efficiency.

Terminal Form:

GULL WING - Provides secure connections for improved reliability in power control systems.

Nominal Turn Off Time (toff):

403 ns - Fast turn-off time enhances power control capabilities for precise operation.

No. of Terminals:

3 - Simplifies connection and installation, reducing complexity in power control circuits.

Package Style (Meter):

SMALL OUTLINE - Compact design saves space and improves heat dissipation in power control applications.

Maximum Operating Temperature:

150 °C - High operating temperature range ensures performance in demanding environments.

Maximum Collector-Emitter Voltage:

1200 V - Supports high voltage requirements for power control applications.

Transistor Element Material:

SILICON - Reliable material choice for long-term operation and durability in power control systems.

Maximum Collector Current (IC):

9.6 A - High current handling capability for efficient power control in various applications.

Terminal Finish:

TIN - Corrosion-resistant finish for extended lifespan and reliability in power control circuits.

Terminal Position:

SINGLE - Simplifies connection and wiring, reducing complexity in power control system design.

Case Connection:

COLLECTOR - Secure connection for efficient power control and heat dissipation in the circuit.

Nominal Turn On Time (ton):

16.1 ns - Quick turn-on time for precise power control and efficient operation in various applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKB03N120H2ATMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

HIGH SPEED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

403 ns

Nominal Turn On Time (ton):

16.1 ns

Trade Compliance

IKB03N120H2ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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