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FZ1800R12HP4B9HOSA2

Infineon Technologies

FZ1800R12HP4B9HOSA2 by Infineon Technologies

FZ1800R12HP4B9HOSA2 by Infineon Technologies is an N-CHANNEL IGBT with 3 elements in parallel configuration. It has a max collector-emitter voltage of 1200V and can handle a max collector current of 2700A, making it ideal for power control applications. With a nominal turn-off time of 1330ns and turn-on time of 720ns, this IGBT is designed for efficient switching operations.

Median Price

$600.860

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 367 parts In-Stock

1+ parts

$480.690

100+ parts

$451.850

1k+ parts

$423.010

10k+ parts

-

367

$480.690

$451.850

$423.010

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DigiKey

USA . 367 parts In-Stock

1+ parts

$600.860

100+ parts

-

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-

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367

$600.860

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-

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Verical

USA . 327 parts In-Stock

1+ parts

$600.862

100+ parts

$564.813

1k+ parts

$528.763

10k+ parts

-

327

$600.862

$564.813

$528.763

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 132 parts In-Stock

1+ parts

$917.082

100+ parts

-

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132

$917.082

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Vyrian

USA . 6,592 parts In-Stock

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6,592

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Corohmni

South Africa . 24 parts In-Stock

1+ parts

$0.842

100+ parts

-

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24

$0.842

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Modulus Dynamics

Lithuania . 16,262 parts In-Stock

1+ parts

$1.129

100+ parts

$1.084

1k+ parts

$1.039

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-

16,262

$1.129

$1.084

$1.039

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Ampacity Inc.

Singapore . 335 parts In-Stock

1+ parts

$820.550

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335

$820.550

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Corphita

USA . 303 parts In-Stock

1+ parts

$868.815

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303

$868.815

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Microchip USA

USA . 5,392 parts In-Stock

1+ parts

$927.190

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5,392

$927.190

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Component Stockers USA

USA . 470 parts In-Stock

1+ parts

$982.600

100+ parts

$923.640

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470

$982.600

$923.640

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Continental Prestige Electronics

USA . 3,572 parts In-Stock

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Argo Parts USA

USA . 3,472 parts In-Stock

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3,472

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Overview

Enhance your power control applications with the FZ1800R12HP4B9HOSA2 by Infineon Technologies. As a leading manufacturer in Insulated Gate Bipolar Transistors, Infineon delivers top-notch quality and reliability. This N-CHANNEL transistor boasts a configuration of parallel 3 elements with built-in diode, providing maximum collector-emitter voltage of 1200V and a high collector current of 2700A. With a nominal turn off time of 1330ns and turn on time of 720ns, this transistor is perfect for demanding power control tasks. Elevate your projects with the superior performance and durability offered by Infineon's FZ1800R12HP4B9HOSA2.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have better performance and efficiency compared to P-CHANNEL IGBTs, making this product a good choice for power control applications.

Nominal Turn Off Time (toff): 1330 ns

With a relatively low turn off time, this IGBT allows for efficient switching and control in power control applications, enhancing overall performance.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating of 1200 V ensures that this IGBT can handle a wide range of voltage levels, making it suitable for diverse power control scenarios.

Maximum Collector Current (IC): 2700 A

With a high maximum collector current rating of 2700 A, this IGBT is capable of handling substantial current loads, making it ideal for high-power applications.

Nominal Turn On Time (ton): 720 ns

The nominal turn on time of 720 ns ensures quick and efficient switching of the IGBT, contributing to improved performance and control in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ1800R12HP4B9HOSA2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X9

Moisture Sensitivity Level (MSL):

1

No. of Elements:

3

No. of Terminals:

9

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1330 ns

Nominal Turn On Time (ton):

720 ns

Trade Compliance

FZ1800R12HP4B9HOSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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