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FF75R12RT4HOSA1

Infineon Technologies

FF75R12RT4HOSA1 by Infineon Technologies

Infineon Technologies' FF75R12RT4HOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and 490ns turn off time. Ideal for POWER CONTROL applications, it has a max voltage of 1200V and operates up to 175°C. The transistor's SILICON material ensures efficient performance in various power systems.

Median Price

$81.650

Lifecycle Status

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9

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1k+

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Verical

USA . 220 parts In-Stock

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$90.825

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$81.263

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$76.475

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$81.263

$76.475

Rochester

USA . 220 parts In-Stock

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$72.660

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$65.010

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$61.180

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$61.180

Arrow

USA . 10 parts In-Stock

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Chip1Stop

Japan . 10 parts In-Stock

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Future Electronics

Canada . 10 parts In-Stock

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$81.650

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Digiode

USA . 213 parts In-Stock

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$70.690

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Rutronik

Germany . 40 parts In-Stock

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$108.200

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Vyrian

USA . 8,088 parts In-Stock

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Nova Conductors

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Modulus Dynamics

Lithuania . 25,878 parts In-Stock

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$0.311

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$0.299

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$0.286

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25,878

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$0.972

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$0.885

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$0.797

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Corohmni

South Africa . 427 parts In-Stock

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$1.795

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AZTECH Wire

Italy . 314 parts In-Stock

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Continental Prestige Electronics

USA . 16 parts In-Stock

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$62.550

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$63.250

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Corphita

USA . 993 parts In-Stock

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$66.969

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Microchip USA

USA . 7,517 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Aranea Global

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GreenTree Electronics

Israel . 120 parts In-Stock

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iodParts Technologies Inc.

India . 41 parts In-Stock

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Overview

Unleash the power of the FF75R12RT4HOSA1 by Infineon Technologies, a cutting-edge Insulated Gate Bipolar Transistor (IGBT) designed to revolutionize power control applications. With its N-CHANNEL configuration, SERIES CONNECTED elements, and built-in diode, this transistor delivers unrivaled performance and reliability. Perfect for high-voltage environments, the FF75R12RT4HOSA1 boasts a maximum Collector-Emitter Voltage of 1200V and an impressive Nominal Turn Off Time of 490ns. Trust in Infineon Technologies' expertise and elevate your projects with the unmatched quality and efficiency of this groundbreaking IGBT.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for higher voltage handling capabilities and improved efficiency in power control circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient performance in demanding environments.

Package Shape: RECTANGULAR

Rectangular packaging offers better space utilization and easier mounting options in various electronic devices.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating allows for reliable operation in high-power applications without risk of breakdown.

Nominal Turn On Time (ton): 185 ns

Fast turn on time ensures quick response and precise control in power switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF75R12RT4HOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X5

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

5

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

490 ns

Nominal Turn On Time (ton):

185 ns

Trade Compliance

FF75R12RT4HOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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