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DDB6U180N16RRPB37BPSA1

Infineon Technologies

DDB6U180N16RRPB37BPSA1 by Infineon Technologies

DDB6U180N16RRPB37BPSA1 by Infineon is an N-CHANNEL IGBT with a 1200V max collector-emitter voltage. It features a single configuration with built-in diode, three-phase diode bridge, and thermistor for power control applications. This UL recognized transistor has a turn-off time of 620ns and turn-on time of 210ns, suitable for flange mount installations.

Median Price

$79.560

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 9 parts In-Stock

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$79.560

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$79.560

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Mouser Electronics

USA . 3 parts In-Stock

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$79.560

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Verical

USA . 8 parts In-Stock

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$93.125

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$84.200

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$84.200

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Rochester

USA . 1 parts In-Stock

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$62.800

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$56.190

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$52.890

1

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$52.890

Distributors (In-Stock)

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Digiode

USA . 612 parts In-Stock

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$67.754

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Vyrian

USA . 8,042 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 9,696 parts In-Stock

1+ parts

$1.540

100+ parts

$1.478

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$1.417

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9,696

$1.540

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$1.417

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Native Components

USA . 196 parts In-Stock

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$5.847

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Corphita

USA . 131 parts In-Stock

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$64.188

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Microchip USA

USA . 4,053 parts In-Stock

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$195.290

100+ parts

$190.080

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$187.480

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$184.870

4,053

$195.290

$190.080

$187.480

$184.870

QUARKTWIN TECHNOLOGY LTD

USA . 17,414 parts In-Stock

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Northwest PG Solutions

USA . 1,536 parts In-Stock

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$5.731

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1,536

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the DDB6U180N16RRPB37BPSA1 by Infineon Technologies. This high-quality insulated gate bipolar transistor (IGBT) offers superior performance in power control applications, providing customers with reliability and efficiency like never before. With a single configuration, built-in diode, three-phase diode bridge, and thermistor, this product is designed to meet the demands of modern technology. Elevate your projects with the Infineon advantage and experience the benefits of cutting-edge engineering at your fingertips.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have higher electron mobility and lower on-state voltage drop, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE, THREE PHASE DIODE BRIDGE AND THERMISTOR

This configuration allows for easy integration into power control systems, providing built-in protection and temperature sensing capabilities.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient performance in controlling high power loads.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into various power control systems.

Nominal Turn Off Time (toff): 620 ns

Fast turn-off time helps in reducing switching losses and improving efficiency in power control applications.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various system configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure and stable mounting options for industrial applications.

Maximum Collector-Emitter Voltage: 1200 V

High maximum voltage rating ensures reliability and safety in handling high voltage operations.

Transistor Element Material: SILICON

Silicon material provides high performance and reliability in power control applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for operation in harsh environments and ensures system reliability.

Terminal Position: UPPER

Upper terminal position facilitates easy access and connection in system integration.

Case Connection: ISOLATED

Isolated case connection enhances safety and protection in power control systems, reducing the risk of electrical faults.

Nominal Turn On Time (ton): 210 ns

Fast turn-on time minimizes delay in power control operations, improving system responsiveness.

Reference Standard: UL RECOGNIZED

UL recognition ensures compliance with safety standards and reliability in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) DDB6U180N16RRPB37BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X24

No. of Elements:

1

No. of Terminals:

24

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

620 ns

Nominal Turn On Time (ton):

210 ns

Trade Compliance

DDB6U180N16RRPB37BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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