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CY90F342CASPFR-GSE1

Infineon Technologies

CY90F342CASPFR-GSE1 by Infineon Technologies

CY90F342CASPFR-GSE1 by Infineon Technologies is a microcontroller with 16-bit size, 24 MHz clock frequency, and 82 I/O lines. It is suitable for industrial applications requiring a wide temperature range (-40 to 105 °C) and features ADC and DMA channels for enhanced functionality. The package style is flatpack with a rectangular shape, making it ideal for surface mount assembly in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 855 parts In-Stock

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855

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Digiode

USA . 702 parts In-Stock

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702

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,320 parts In-Stock

1+ parts

$10.000

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1,320

$10.000

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AZTECH Wire

Italy . 855 parts In-Stock

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$17.202

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855

$17.202

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Aztec Data Supply Inc.

USA . 116 parts In-Stock

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$22.490

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116

$22.490

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Semicontronic

India . 832 parts In-Stock

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$23.000

100+ parts

$22.425

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$22.310

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832

$23.000

$22.425

$22.310

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Corohmni

South Africa . 269 parts In-Stock

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$66.067

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269

$66.067

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Modulus Dynamics

Lithuania . 4,422 parts In-Stock

1+ parts

$85.114

100+ parts

$81.709

1k+ parts

$78.305

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4,422

$85.114

$81.709

$78.305

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,157 parts In-Stock

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2,157

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Corphita

USA . 835 parts In-Stock

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835

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Argo Parts USA

USA . 195 parts In-Stock

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195

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Microchip USA

USA . 158 parts In-Stock

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158

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the full potential of your electronic devices with the CY90F342CASPFR-GSE1 by Infineon Technologies. As a leader in microcontroller technology, Infineon delivers unparalleled quality and reliability in every product. Ideal for industrial applications, this microcontroller offers high-speed performance and versatile functionality. With a wide range of features and capabilities, the CY90F342CASPFR-GSE1 provides exceptional value and benefits to customers looking to optimize their systems. Upgrade your electronics today with the cutting-edge technology of Infineon microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is cost-effective, lightweight, and provides good protection for the microcontroller.

Surface Mount: YES

Surface-mount technology offers space-saving advantages and makes the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V allows for flexibility in power input options.

Address Bus Width: 24

A wider address bus width of 24 bits allows for larger memory addressing capability.

Bit Size: 16

16-bit processing provides a good balance between performance and power consumption.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options with other components.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile and efficient use of board space.

Minimum Supply Voltage: 4 V

Support for a minimum supply voltage of 4V ensures operational reliability even under low-power conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes the microcontroller suitable for industrial applications with demanding environmental conditions.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors or inputs.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfers without CPU intervention, improving performance.

Terminal Position: QUAD

Quad terminal position enhances the stability of connections and simplifies PCB layout.

Maximum Seated Height: 3.35 mm

Low maximum seated height enables compact and slim device designs.

Width: 14 mm

Narrow width facilitates space-efficient PCB layouts.

External Data Bus Width: 16

Having a wide external data bus width of 16 bits enhances data transfer speeds and processing capabilities.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency of 24 MHz enables fast execution of instructions for responsive performance.

Length: 20 mm

Compact length allows for flexibility in positioning the microcontroller on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh temperature environments.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, the product is optimized for executing specific control tasks in embedded systems.

Technology: CMOS

CMOS technology offers a good balance between performance, power consumption, and cost-effectiveness.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering on the PCB, ensuring reliable connections.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V is standard and compatible with many electronic components.

ROM Programmability: FLASH

ROM programmability using FLASH technology allows for easy firmware updates and customization.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables high-density mounting and efficient use of PCB space.

Speed: 24 rpm

Operational speed of 24 rpm ensures efficient processing of instructions and data.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits provides sufficient storage for firmware and program code.

No. of I/O Lines: 82

Having 82 I/O lines allows for a wide range of input/output configurations for external interfacing.

Technical Specifications

Microcontrollers CY90F342CASPFR-GSE1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of I/O Lines:

82

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

3.35 mm

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CY90F342CASPFR-GSE1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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