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CY90F345CASPFR-GS-UJE1

Infineon Technologies

CY90F345CASPFR-GS-UJE1 by Infineon Technologies

Infineon's CY90F345CASPFR-GS-UJE1 microcontroller features 16-bit CPU, 24 MHz clock speed, and 8 KB RAM. Ideal for applications requiring low power consumption, it supports CAN(2), I2C(2), UART(4) connectivity and offers 24-Ch 10-Bit ADC channels. With a wide operating temperature range (-40 to 105 °C), this device is suitable for various embedded systems.

Median Price

$30.730

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,383 parts In-Stock

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-

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8,383

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Digiode

USA . 961 parts In-Stock

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961

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Nova Conductors

Japan . 870 parts In-Stock

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870

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TME

Poland . 112 parts In-Stock

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$30.730

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112

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$30.730

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 443 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

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-

443

$2.000

$1.950

$1.940

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Ampacity Inc.

Singapore . 675 parts In-Stock

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$10.000

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675

$10.000

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Modulus Dynamics

Lithuania . 3,038 parts In-Stock

1+ parts

$18.538

100+ parts

$17.796

1k+ parts

$17.055

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3,038

$18.538

$17.796

$17.055

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AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$18.726

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244

$18.726

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Corohmni

South Africa . 974 parts In-Stock

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$19.909

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974

$19.909

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Aztec Data Supply Inc.

USA . 24,331 parts In-Stock

1+ parts

$68.290

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24,331

$68.290

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Continental Prestige Electronics

USA . 5,330 parts In-Stock

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5,330

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Argo Parts USA

USA . 3,911 parts In-Stock

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Microchip USA

USA . 412 parts In-Stock

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412

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Corphita

USA . 243 parts In-Stock

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243

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Overview

Unlock the power of cutting-edge technology with the CY90F345CASPFR-GS-UJE1 microcontroller from Infineon Technologies. As a leader in the industry, Infineon delivers top-quality products that are designed to exceed expectations. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and reliability. Experience seamless connectivity and advanced features that will take your projects to the next level. Upgrade to the CY90F345CASPFR-GS-UJE1 today and discover the endless possibilities it has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product long-lasting and affordable.

Maximum Supply Voltage: 5.5 V

Operating at a maximum supply voltage of 5.5 V allows for high power efficiency and performance.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for various peripherals and interfaces, making it versatile.

ADC Channels: YES

Having ADC channels allows for analog input capabilities, making it suitable for applications that require analog-to-digital conversion.

Connectivity: CAN(2), I2C(2), UART(4)

Multiple connectivity options like CAN, I2C, and UART make it compatible with a wide range of communication protocols and devices.

RAM Bytes: 20480

With a significant amount of RAM, the product can handle complex programs and data processing efficiently.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the overall performance of the product.

Speed: 24 rpm

Operating at a speed of 24 rpm allows for quick data processing and efficient performance in real-time applications.

Technical Specifications

Microcontrollers CY90F345CASPFR-GS-UJE1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Boundary Scan:

NO

CPU Family:

F2MC-16LX

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

82

No. of Terminals:

100

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9,26

Package Shape:

Package Style (Meter):

FLATPACK

RAM Bytes:

20480

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

3.45 mm

Speed:

24 rpm

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), UART(4)

Peripherals:

DMA(16), POR, TIMER(8), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

CY90F345CASPFR-GS-UJE1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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