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CY90F342CASPFR-GSUJE1

Infineon Technologies

CY90F342CASPFR-GSUJE1 by Infineon Technologies

Infineon's CY90F342CASPFR-GSUJE1 is a 16-bit microcontroller with 24 MHz clock frequency, 262144 ROM words, and 16384 RAM bytes. Ideal for industrial applications, it features 24 ADC channels, 16 DMA channels, and connectivity options like CAN(2), I2C(2), UART(4).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 887 parts In-Stock

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Vyrian

USA . 298 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Semicontronic

India . 201 parts In-Stock

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$14.000

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$13.650

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$13.580

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201

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Ampacity Inc.

Singapore . 1,230 parts In-Stock

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$18.000

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AZTECH Wire

Italy . 298 parts In-Stock

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$18.825

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Modulus Dynamics

Lithuania . 4,550 parts In-Stock

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$22.323

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$21.430

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$20.537

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$22.323

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Corohmni

South Africa . 73 parts In-Stock

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$80.650

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Continental Prestige Electronics

USA . 5,678 parts In-Stock

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Argo Parts USA

USA . 2,228 parts In-Stock

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Microchip USA

USA . 403 parts In-Stock

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Corphita

USA . 127 parts In-Stock

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Unlock endless possibilities with the CY90F342CASPFR-GSUJE1 by Infineon Technologies. As a leading manufacturer of high-quality microcontrollers, Infineon brings you a cutting-edge product that is versatile and reliable. Ideal for a wide range of applications, this microcontroller offers exceptional value with its advanced features and benefits. Experience seamless connectivity, powerful performance, and efficient operation with the CY90F342CASPFR-GSUJE1. Elevate your projects with this top-of-the-line microcontroller and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power input, making the microcontroller versatile in different applications.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle complex computations and tasks efficiently.

ROM Words: 262144

Having a large ROM capacity allows for storing extensive program code and data.

Maximum Clock Frequency: 24 MHz

The high clock frequency enables fast processing speeds, critical for real-time applications.

Connectivity: CAN(2), I2C(2), UART(4)

Multiple communication interfaces allow for versatile connectivity options with other devices.

Low Power Mode: YES

The low power mode helps in conserving energy and prolonging battery life in portable devices.

Technical Specifications

Microcontrollers CY90F342CASPFR-GSUJE1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Boundary Scan:

NO

CPU Family:

16LX

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED-POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

82

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3.35 mm

Speed:

24 rpm

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), UART(4)

Peripherals:

DMA(16), POR, TIMER(38), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

CY90F342CASPFR-GSUJE1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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