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CY90F352SPMC-GS-SPE1

Infineon Technologies

CY90F352SPMC-GS-SPE1 by Infineon Technologies

Infineon CY90F352SPMC-GS-SPE1 is a 16-bit microcontroller with 131072 ROM words, 4096 RAM words, and 8-bit on-chip data RAM. Ideal for industrial applications, it features 15-Ch ADCs, CAN connectivity, and operates at up to 24 MHz clock frequency.

Median Price

$22.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$22.750

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50

$22.750

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Vyrian

USA . 692 parts In-Stock

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692

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Digiode

USA . 528 parts In-Stock

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528

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Rutronik

Germany . 476 parts In-Stock

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476

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Distributors (Availability)

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Semicontronic

India . 652 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

10k+ parts

-

652

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 780 parts In-Stock

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$12.866

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780

$12.866

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Continental Prestige Electronics

USA . 4,252 parts In-Stock

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$22.750

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$22.295

4,252

$22.750

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$22.295

Netroflash

USA . 50 parts In-Stock

1+ parts

$22.750

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$22.750

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Ampacity Inc.

Singapore . 396 parts In-Stock

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$26.000

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396

$26.000

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Aztec Data Supply Inc.

USA . 267 parts In-Stock

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$32.460

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267

$32.460

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Corohmni

South Africa . 136 parts In-Stock

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$41.846

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$41.846

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Modulus Dynamics

Lithuania . 4,071 parts In-Stock

1+ parts

$72.035

100+ parts

$69.154

1k+ parts

$66.272

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4,071

$72.035

$69.154

$66.272

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,271 parts In-Stock

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Microchip USA

USA . 1,425 parts In-Stock

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Corphita

USA . 804 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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15

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Overview

Unlock the potential of your next project with the CY90F352SPMC-GS-SPE1 by Infineon Technologies, a top-of-the-line microcontroller designed for industrial-grade applications. With its cutting-edge technology and superior performance, this compact yet powerful device offers unparalleled reliability and efficiency. Whether you're working on automotive systems, industrial automation, or consumer electronics, this versatile microcontroller delivers unmatched value and benefits, making it the ideal choice for all your embedded system needs. Experience innovation like never before with the CY90F352SPMC-GS-SPE1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

No. of External Interrupts: 8

Having 8 external interrupts allows the microcontroller to respond quickly to external events or signals, enhancing its real-time capabilities.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors or signals, expanding its input capabilities.

No. of Timers: 5

Multiple timers provide precise timing control for various functions or tasks, enhancing the microcontroller's versatility in time-sensitive applications.

Connectivity: CAN, I2C, UART(2)

Support for multiple communication interfaces like CAN, I2C, and UART enhances the microcontroller's connectivity options for seamless integration with other devices or systems.

Technical Specifications

Microcontrollers CY90F352SPMC-GS-SPE1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

NO

CPU Family:

F2MC-16LX

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

8

No. of I/O Lines:

51

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

4096

RAM Words:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

24 rpm

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, UART(2)

Peripherals:

DMA(16), POR, TIMER(16), WDT

Analog To Digital Convertors:

15-Ch 8-Bit, 15-ch 10-Bit

Trade Compliance

CY90F352SPMC-GS-SPE1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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