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CY90F349CASPFR-GSE1

Infineon Technologies

CY90F349CASPFR-GSE1 by Infineon Technologies

CY90F349CASPFR-GSE1 by Infineon is a 16-bit microcontroller with 24-bit address bus width, operating at up to 24 MHz. Ideal for industrial applications, it features ADC and DMA channels, FLASH ROM programmability, and operates in temperatures ranging from -40°C to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 601 parts In-Stock

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601

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Vyrian

USA . 248 parts In-Stock

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248

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,473 parts In-Stock

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$25.000

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$25.000

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Modulus Dynamics

Lithuania . 3,371 parts In-Stock

1+ parts

$67.831

100+ parts

$65.118

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$62.405

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3,371

$67.831

$65.118

$62.405

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Argo Parts USA

USA . 1,783 parts In-Stock

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1,783

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Continental Prestige Electronics

USA . 1,078 parts In-Stock

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1,078

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Microchip USA

USA . 468 parts In-Stock

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468

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Corphita

USA . 173 parts In-Stock

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173

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Glotronic Ltd.

UK . 131 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the CY90F349CASPFR-GSE1 microcontroller by Infineon Technologies. Crafted with precision and expertise, this device offers seamless integration and high performance in a wide range of industrial applications. From its robust construction to its advanced features, this microcontroller is designed to deliver unparalleled value and efficiency to customers. Elevate your projects to new heights with the CY90F349CASPFR-GSE1 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of supply voltage, providing flexibility in different applications.

Bit Size: 16

Provides a good balance between performance and efficiency for processing data.

ADC Channels: YES

Having ADC Channels enables the microcontroller to interface with analog sensors, expanding its capabilities.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast processing speed, suitable for applications that require quick data processing.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, making it versatile for different firmware updates.

Technical Specifications

Microcontrollers CY90F349CASPFR-GSE1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

No. of I/O Lines:

82

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

ROM Programmability:

FLASH

Maximum Seated Height:

3.35 mm

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CY90F349CASPFR-GSE1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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