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CY7C1041G30-10BVXIT

Infineon Technologies

CY7C1041G30-10BVXIT by Infineon Technologies

Infineon's CY7C1041G30-10BVXIT is a 256Kx16 SRAM with 100MHz clock frequency, 10ns access time, and 3-state output. Ideal for applications requiring fast and reliable memory storage in devices like networking equipment, industrial automation systems, and telecommunications infrastructure.

Median Price

$6.090

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,210 parts In-Stock

1+ parts

$6.090

100+ parts

$5.247

1k+ parts

$4.828

10k+ parts

$4.706

2,210

$6.090

$5.247

$4.828

$4.706

Mouser Electronics

USA . 266 parts In-Stock

1+ parts

$6.090

100+ parts

$5.250

1k+ parts

$4.830

10k+ parts

$4.700

266

$6.090

$5.250

$4.830

$4.700

Flip Electronics (Authorized)

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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Verical

USA . 4,000 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

$7.266

4,000

-

-

-

$7.266

Rochester

USA . 801 parts In-Stock

1+ parts

-

100+ parts

$3.230

1k+ parts

$2.890

10k+ parts

$2.720

801

-

$3.230

$2.890

$2.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 596 parts In-Stock

1+ parts

$6.726

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$6.726

-

-

-

Chip Stock

USA . 101,974 parts In-Stock

1+ parts

-

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101,974

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-

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Vyrian

USA . 5,957 parts In-Stock

1+ parts

-

100+ parts

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5,957

-

-

-

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Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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4,000

-

-

-

-

LIBRA Elektronik GmbH

Germany . 908 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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908

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,185 parts In-Stock

1+ parts

$2.346

100+ parts

$2.252

1k+ parts

$2.158

10k+ parts

-

3,185

$2.346

$2.252

$2.158

-

Aztec Data Supply Inc.

USA . 164 parts In-Stock

1+ parts

$4.849

100+ parts

-

1k+ parts

-

10k+ parts

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164

$4.849

-

-

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Corohmni

South Africa . 598 parts In-Stock

1+ parts

$5.476

100+ parts

-

1k+ parts

-

10k+ parts

-

598

$5.476

-

-

-

Corphita

USA . 442 parts In-Stock

1+ parts

$6.372

100+ parts

-

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10k+ parts

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442

$6.372

-

-

-

Semicontronic

India . 5,747 parts In-Stock

1+ parts

$6.430

100+ parts

$6.269

1k+ parts

$6.237

10k+ parts

-

5,747

$6.430

$6.269

$6.237

-

Ampacity Inc.

Singapore . 5,856 parts In-Stock

1+ parts

$13.990

100+ parts

-

1k+ parts

-

10k+ parts

-

5,856

$13.990

-

-

-

Component Stockers USA

USA . 260 parts In-Stock

1+ parts

$96.980

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$96.980

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,167 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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25,167

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

-

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Continental Prestige Electronics

USA . 1,869 parts In-Stock

1+ parts

-

100+ parts

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1,869

-

-

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Argo Parts USA

USA . 242 parts In-Stock

1+ parts

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242

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Bastille Electronics

Australia . 46 parts In-Stock

1+ parts

-

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46

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-

Overview

Enhance your electronic projects with the Infineon Technologies CY7C1041G30-10BVXIT, a top-of-the-line SRAM memory chip that guarantees superior performance and reliability. Infineon Technologies is renowned for its high-quality products, and this SRAM chip is no exception. Ideal for a wide range of applications, this memory chip offers customers exceptional value with its fast access time, low standby current, and versatile package style. Elevate your projects with the CY7C1041G30-10BVXIT and experience the seamless integration and efficiency it brings to your designs.

Feature Benefit Bullets

Nominal Joule Integral: 91 J

High joule rating provides effective protection against power surges and voltage spikes, ensuring the safety of equipment connected to the fuse.

Rated AC Voltage: 250 V

Suitable for use in standard AC electrical circuits, making it compatible with most household and industrial applications.

Body Length/Diameter: 5.2 mm

Compact size allows for easy installation in tight spaces without compromising on performance.

Rated Current: 4 A

The rated current capacity of 4A ensures protection against overcurrent situations while allowing normal current flow.

Blow Characteristic: TIME DELAY

Time delay blow characteristic prevents nuisance tripping during temporary overloads, providing reliable protection for the circuit.

Mounting Feature: INLINE/HOLDER

Can be easily mounted in-line or in a suitable fuse holder, making installation and replacement convenient.

Technical Specifications

SRAM CY7C1041G30-10BVXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Maximum Clock Frequency (fCLK):

100 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

1 V

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

CY7C1041G30-10BVXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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