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CY15E064Q-SXET

Infineon Technologies

CY15E064Q-SXET by Infineon Technologies

CY15E064Q-SXET by Infineon Technologies is a FRAM with 8Kx8 organization, operating at 5V. It offers synchronous operation, 16MHz clock frequency, and SPI serial bus type. Ideal for automotive applications due to AEC-Q100 screening level and high endurance of 10^13 write/erase cycles.

Median Price

$3.800

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,841 parts In-Stock

1+ parts

$2.534

100+ parts

$2.407

1k+ parts

$2.398

10k+ parts

-

1,841

$2.534

$2.407

$2.398

-

Chip1Stop

Japan . 940 parts In-Stock

1+ parts

$4.980

100+ parts

$4.360

1k+ parts

-

10k+ parts

-

940

$4.980

$4.360

-

-

DigiKey

USA . 1,897 parts In-Stock

1+ parts

$4.990

100+ parts

$4.304

1k+ parts

$3.962

10k+ parts

$3.830

1,897

$4.990

$4.304

$3.962

$3.830

Mouser Electronics

USA . 960 parts In-Stock

1+ parts

$4.990

100+ parts

$4.310

1k+ parts

$3.970

10k+ parts

$3.570

960

$4.990

$4.310

$3.970

$3.570

Flip Electronics (Authorized)

USA . 69,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69,000

-

-

-

-

Verical

USA . 68,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.198

10k+ parts

-

68,160

-

-

$2.198

-

Rochester

USA . 18,552 parts In-Stock

1+ parts

-

100+ parts

$2.620

1k+ parts

$2.350

10k+ parts

$2.210

18,552

-

$2.620

$2.350

$2.210

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 543 parts In-Stock

1+ parts

$2.109

100+ parts

-

1k+ parts

-

10k+ parts

-

543

$2.109

-

-

-

Vyrian

USA . 260 parts In-Stock

1+ parts

$2.220

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$2.220

-

-

-

Flip Electronics

USA . 69,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 415 parts In-Stock

1+ parts

$1.998

100+ parts

-

1k+ parts

-

10k+ parts

-

415

$1.998

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,869

-

-

-

-

GreenTree Electronics

Israel . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Lixinc

USA . 17,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,232

-

-

-

-

Northwest PG Solutions

USA . 2,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,175

-

-

-

-

Native Components

USA . 615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

615

-

-

-

-

Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the CY15E064Q-SXET by Infineon Technologies. As a leading manufacturer in the industry, Infineon is known for delivering top-quality FRAMs that offer unparalleled reliability and performance. Ideal for a wide range of applications, this product combines innovative features with a user-friendly design to provide customers with exceptional value and benefits. Experience seamless operation, increased efficiency, and superior data retention with the CY15E064Q-SXET - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures high quality and reliability, making it suitable for automotive applications where robustness is essential.

Operating Mode: SYNCHRONOUS

Enables efficient data transfer and processing, improving overall performance of the product.

Nominal Supply Voltage / Vsup (V): 5

Provides a stable power source for consistent operation of the product.

No. of Terminals: 8

Offers multiple connection points for interfacing with other components, enhancing versatility and integration capabilities.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board, making it ideal for applications with limited real estate.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliability even in harsh environments.

Technical Specifications

FRAMs CY15E064Q-SXET attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

16 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00003 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15E064Q-SXET Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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