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CY15B064J-SXET

Infineon Technologies

CY15B064J-SXET by Infineon Technologies

Infineon's CY15B064J-SXET FRAM features 8Kx8 organization, operates at 1MHz clock frequency, and has a 3.3V nominal voltage. Ideal for applications requiring high endurance like automotive systems due to AEC-Q100 screening level and -40 to 125°C operating temperature range.

Median Price

$3.876

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,539 parts In-Stock

1+ parts

$3.952

100+ parts

$3.836

1k+ parts

$3.719

10k+ parts

-

1,539

$3.952

$3.836

$3.719

-

DigiKey

USA . 8,473 parts In-Stock

1+ parts

$4.990

100+ parts

$4.304

1k+ parts

$3.962

10k+ parts

$4.196

8,473

$4.990

$4.304

$3.962

$4.196

Mouser Electronics

USA . 4,198 parts In-Stock

1+ parts

$4.990

100+ parts

$4.310

1k+ parts

$3.970

10k+ parts

$3.820

4,198

$4.990

$4.310

$3.970

$3.820

Rochester

USA . 22,925 parts In-Stock

1+ parts

-

100+ parts

$2.890

1k+ parts

$2.580

10k+ parts

$2.430

22,925

-

$2.890

$2.580

$2.430

Verical

USA . 11,935 parts In-Stock

1+ parts

-

100+ parts

$3.800

1k+ parts

$3.225

10k+ parts

$3.038

11,935

-

$3.800

$3.225

$3.038

Future Electronics

Canada . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.620

7,500

-

-

-

$2.620

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.607

5,000

-

-

-

$2.607

RS (Exports)

UK . 95 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.543

95

-

-

-

$4.543

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 135 parts In-Stock

1+ parts

$3.154

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$3.154

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$3.855

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$3.855

-

-

-

Chip Stock

USA . 32,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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32,343

-

-

-

-

IBS Electronics

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.109

7,500

-

-

-

$4.109

Vyrian

USA . 6,064 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,064

-

-

-

-

Component Sense

UK . 2,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,684

-

-

-

-

Cyclops Electronics Ltd

UK . 2,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,429

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,941 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

-

10k+ parts

-

5,941

$2.130

-

-

-

Corphita

USA . 499 parts In-Stock

1+ parts

$2.988

100+ parts

-

1k+ parts

-

10k+ parts

-

499

$2.988

-

-

-

Continental Prestige Electronics

USA . 5,908 parts In-Stock

1+ parts

$3.566

100+ parts

-

1k+ parts

-

10k+ parts

$3.495

5,908

$3.566

-

-

$3.495

Argo Parts USA

USA . 3,368 parts In-Stock

1+ parts

$3.566

100+ parts

-

1k+ parts

-

10k+ parts

-

3,368

$3.566

-

-

-

Component Stockers USA

USA . 6,747 parts In-Stock

1+ parts

$3.720

100+ parts

$3.210

1k+ parts

$2.790

10k+ parts

-

6,747

$3.720

$3.210

$2.790

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$3.855

100+ parts

-

1k+ parts

$3.663

10k+ parts

$3.586

50

$3.855

-

$3.663

$3.586

QUARKTWIN TECHNOLOGY LTD

USA . 16,537 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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16,537

-

-

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Futuretech Components

Singapore . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

-

-

-

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Eastek

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,500

-

-

-

-

iodParts Technologies Inc.

India . 358 parts In-Stock

1+ parts

-

100+ parts

$4.435

1k+ parts

-

10k+ parts

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358

-

$4.435

-

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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20

-

-

-

-

Overview

Unlock the potential of your applications with the CY15B064J-SXET by Infineon Technologies, a top-of-the-line FRAM memory IC that offers unmatched reliability and performance. With a manufacturer like Infineon Technologies, known for its high-quality products, you can trust that this FRAM will exceed your expectations. Ideal for various industries and projects, this FRAM's advanced features and benefits, such as 10000000000000 write/erase cycles and a wide operating temperature range, ensure seamless integration and long-term durability. Upgrade your systems today with the CY15B064J-SXET and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product will have a long lifespan.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common voltage level makes it compatible with many systems and applications.

No. of Terminals: 8

Having a small number of terminals simplifies installation and reduces potential points of failure.

Maximum Operating Temperature: 125 °C

Being able to operate at high temperatures ensures reliability and performance in various environments.

Memory IC Type: FRAM

FRAM technology offers fast read/write speeds, high endurance, and low power consumption compared to traditional memory types.

Technical Specifications

FRAMs CY15B064J-SXET attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.889 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

.34 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Write Protection:

HARDWARE

Trade Compliance

CY15B064J-SXET Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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