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BTS5441G

Infineon Technologies

BTS5441G by Infineon Technologies

BTS5441G by Infineon Technologies is a peripheral driver with a plastic/epoxy package. It is surface mountable and has 28 terminals in a small outline rectangular shape. With MOS technology, it operates at power supplies of 9/16V and is suitable for applications requiring 4-bit drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,162 parts In-Stock

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6,162

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VNN

France . 2,414 parts In-Stock

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2,414

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Digiode

USA . 768 parts In-Stock

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768

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Nova Conductors

Japan . 83 parts In-Stock

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83

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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19

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,041 parts In-Stock

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$2.500

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1,041

$2.500

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Aztec Data Supply Inc.

USA . 4,079 parts In-Stock

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$6.210

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4,079

$6.210

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Modulus Dynamics

Lithuania . 4,141 parts In-Stock

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$7.107

100+ parts

$6.823

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$6.538

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4,141

$7.107

$6.823

$6.538

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AZTECH Wire

Italy . 757 parts In-Stock

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$8.630

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757

$8.630

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Corohmni

South Africa . 292 parts In-Stock

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$12.924

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292

$12.924

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$15.430

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$14.041

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$12.653

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3,000

$15.430

$14.041

$12.653

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Andel Nordic

Denmark . 2,222 parts In-Stock

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$41.170

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$28.817

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$28.817

2,222

$41.170

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$28.817

$28.817

Continental Prestige Electronics

USA . 6,927 parts In-Stock

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Lixinc

USA . 5,215 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Argo Parts USA

USA . 2,592 parts In-Stock

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2,592

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Kepictronics

USA . 740 parts In-Stock

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740

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Corphita

USA . 305 parts In-Stock

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305

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Microchip USA

USA . 282 parts In-Stock

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282

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Overview

Unlock the potential of your electronic devices with the BTS5441G by Infineon Technologies. As a trusted manufacturer of peripheral drivers, Infineon Technologies ensures exceptional quality and reliability in every product. The BTS5441G offers a wide range of applications including automotive systems and industrial automation. Experience the value of seamless performance and improved functionality with this small outline driver. Its advanced MOS technology and 4-bit driver configuration guarantee optimized power supplies, making it an ideal choice for your next project. Upgrade your devices with the BTS5441G and enjoy the benefits of superior performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and light-weight design, making it an ideal choice for portable and long-lasting peripheral drivers.

Surface Mount: YES

With surface mount capability, this peripheral driver can be easily mounted onto a printed circuit board, providing a convenient and space-saving solution for various electronic applications.

Package Shape: RECTANGULAR

By featuring a rectangular package shape, this peripheral driver maximizes efficient use of space and facilitates easy integration into different electronic systems, making it a versatile choice for a wide range of applications.

Power Supplies (V): 9/16

The peripheral driver supports multiple power supply options, with voltage compatibility ranging from 9V to 16V. This flexibility allows for compatibility with different power sources, enhancing usability and adaptability.

No. of Terminals: 28

With a generous number of 28 terminals, this peripheral driver enables seamless connectivity and compatibility with a wide array of peripheral devices, offering extensive possibilities for expansion and integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this peripheral driver ensures efficient usage of limited space while maintaining high performance. Its compact form factor makes it an excellent choice for applications where size is a constraint.

Terminal Position: DUAL

Featuring dual terminal positions, this peripheral driver offers versatile installation options that accommodate various board layouts. The flexible terminal positioning enhances convenience and facilitates integration into diverse systems.

Technology: MOS

Utilizing MOS (Metal-Oxide-Semiconductor) technology ensures high-speed performance and low power consumption. This peripheral driver's MOS technology enhances efficiency and extends battery life, making it an energy-efficient option.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process during assembly, ensuring secure and reliable electrical connections. This feature enhances ease of use and reliability, making it an ideal choice for manufacturers.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and compact packaging of the peripheral driver. This compact terminal spacing enables efficient utilization of board space, making it suitable for applications with limited PCB real estate.

Driver No. of Bits: 4

This peripheral driver supports a driver no. of bits of 4, allowing for efficient and accurate control of peripheral devices. With its high precision and versatility, this product is suitable for applications demanding precise control and optimal performance.

Technical Specifications

Peripheral Drivers BTS5441G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

BTS5441G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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