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BSC119N03MSCG

Infineon Technologies

BSC119N03MSCG by Infineon Technologies

BSC119N03MSCG by Infineon Technologies is a N-CHANNEL Power FET with 30V DS Breakdown Voltage. It features a max IDM of 156A and 0.0119 ohm Drain-Source On Resistance, suitable for SWITCHING applications. This MOSFET operates in ENHANCEMENT MODE, with an EAS of 10mJ and can handle up to 11A Drain Current at a max temp of 150°C.

Median Price

$0.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160,000 parts In-Stock

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$0.230

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$0.230

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$0.220

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160,000

$0.230

$0.230

$0.220

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Distributors (In-Stock)

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Nova Conductors

Japan . 85 parts In-Stock

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$0.235

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85

$0.235

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Digiode

USA . 989 parts In-Stock

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$0.263

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989

$0.263

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DigiKey Marketplace

USA . 160,000 parts In-Stock

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$0.270

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160,000

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$0.270

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Vyrian

USA . 5,069 parts In-Stock

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5,069

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VNN

France . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 159,810 parts In-Stock

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$0.235

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159,810

$0.235

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Netroflash

USA . 2,000 parts In-Stock

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$0.235

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Corphita

USA . 46 parts In-Stock

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$0.249

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46

$0.249

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Modulus Dynamics

Lithuania . 915 parts In-Stock

1+ parts

$1.419

100+ parts

$1.362

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$1.305

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915

$1.419

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$1.305

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AZTECH Wire

Italy . 1,050 parts In-Stock

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$15.780

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$15.780

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A-Z Elektronik GmbH

Germany . 6,930 parts In-Stock

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6,930

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Alle Elektronik GmbH

Germany . 4,620 parts In-Stock

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Kepictronics

USA . 46 parts In-Stock

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET) for your switching applications? Look no further than the BSC119N03MSCG by Infineon Technologies. With its N-CHANNEL polarity and SINGLE configuration with built-in diode, this transistor offers enhanced performance and efficiency. Its small outline package and matte tin terminal finish make it perfect for surface mount applications. Trust in the expertise of Infineon Technologies to deliver superior products that meet your needs. Upgrade your electronics with the BSC119N03MSCG and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better conductivity and efficiency, making this transistor a reliable choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect the transistor from reverse voltage spikes, enhancing the overall reliability of the system.

Transistor Application: SWITCHING

Designed for switching applications, this field effect transistor offers fast switching speeds and high efficiency, making it suitable for various electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and compact PCB assembly, making this transistor suitable for space-constrained applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this transistor can handle high voltage loads, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 156 A

The high maximum pulsed drain current rating of 156 A allows this transistor to handle high power output and transient loads.

Avalanche Energy Rating (EAS): 10 mJ

The low avalanche energy rating of 10 mJ ensures the transistor can withstand voltage spikes without failure, improving overall reliability.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can operate in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) BSC119N03MSCG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

10 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.0119 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

156 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC119N03MSCG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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