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BGA751N7E6327XTSA1

Infineon Technologies

BGA751N7E6327XTSA1 by Infineon Technologies

BGA751N7E6327XTSA1 by Infineon is a small outline, heat sink telecom IC with 6 terminals. Operating b/w -30 to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom circuits, this bipolar technology IC is surface mountable and tin-finished.

Median Price

$0.474

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36,491 parts In-Stock

1+ parts

-

100+ parts

$0.474

1k+ parts

$0.394

10k+ parts

$0.351

36,491

-

$0.474

$0.394

$0.351

Verical

USA . 28,991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.492

10k+ parts

$0.439

28,991

-

-

$0.492

$0.439

DigiKey

USA . 13,991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.400

10k+ parts

$0.400

13,991

-

-

$0.400

$0.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.353

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.353

-

-

-

Digiode

USA . 110 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$0.370

-

-

-

Vyrian

USA . 13,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,799

-

-

-

-

VNN

France . 4,229 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,229

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,707 parts In-Stock

1+ parts

$0.331

100+ parts

-

1k+ parts

-

10k+ parts

-

11,707

$0.331

-

-

-

Corphita

USA . 826 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

-

10k+ parts

-

826

$0.350

-

-

-

Modulus Dynamics

Lithuania . 2,596 parts In-Stock

1+ parts

$13.587

100+ parts

$13.044

1k+ parts

$12.500

10k+ parts

-

2,596

$13.587

$13.044

$12.500

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.346

1k+ parts

$0.335

10k+ parts

$0.328

1,000

-

$0.346

$0.335

$0.328

Overview

Unlock the power of seamless communication with the BGA751N7E6327XTSA1 by Infineon Technologies. This innovative telecom interface IC offers unparalleled quality and reliability, backed by Infineon's reputation for excellence. Ideal for a wide range of applications, this product is designed to provide customers with superior performance and value. Experience smooth operation and enhanced connectivity with the BGA751N7E6327XTSA1 - the perfect choice for your telecommunications needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and lightweight, making the product suitable for various applications and environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard board layouts and facilitates easy integration into existing designs.

No. of Terminals: 6

Having 6 terminals enables the IC to connect to multiple external components, increasing functionality and versatility.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile design allows for efficient heat dissipation and space-saving in compact electronic devices.

Maximum Operating Temperature: 85°C

High maximum operating temperature ensures reliability and stability of the IC even in demanding operating conditions.

Minimum Operating Temperature: -30°C

Wide operating temperature range allows the IC to function effectively in both extreme cold and hot environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, enhancing the longevity of the product.

Terminal Position: DUAL

Dual terminal position allows for flexible and secure connections, ensuring stable performance of the IC.

Maximum Seated Height: 0.4 mm

Ultra-thin maximum seated height facilitates low-profile design and compact arrangement of components in devices.

Width: 1.3 mm

Narrow width enables the IC to be used in space-constrained applications without sacrificing functionality.

Length: 2 mm

Compact length makes the IC suitable for small form factor devices and systems with limited space availability.

Technology: BIPOLAR

Bipolar technology offers stable and reliable performance, making the IC suitable for critical telecom applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, promoting sustainability.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC provides optimized performance and functionality in communication systems.

Nominal Supply Voltage: 2.8 V

Optimal nominal supply voltage ensures efficient power consumption and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and signal transmission, enhancing the overall performance of the IC.

Technical Specifications

Other Function Telecom Interface ICs BGA751N7E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.3 mm

Trade Compliance

BGA751N7E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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