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BGA7M1N6E6327XTSA1

Infineon Technologies

BGA7M1N6E6327XTSA1 by Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

Median Price

$0.521

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$0.077

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$0.077

-

-

-

Newark

USA . 12,438 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

-

12,438

$0.510

-

-

-

Element14

Singapore . 14,908 parts In-Stock

1+ parts

$73.380

100+ parts

$51.710

1k+ parts

$38.770

10k+ parts

$34.360

14,908

$73.380

$51.710

$38.770

$34.360

Rochester

USA . 766,993 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.372

766,993

-

$0.502

$0.417

$0.372

DigiKey

USA . 735,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

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735,000

-

-

$0.630

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Verical

USA . 620,500 parts In-Stock

1+ parts

-

100+ parts

-

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$0.521

10k+ parts

$0.465

620,500

-

-

$0.521

$0.465

Farnell

UK . 13,488 parts In-Stock

1+ parts

-

100+ parts

$0.564

1k+ parts

$0.339

10k+ parts

$0.319

13,488

-

$0.564

$0.339

$0.319

Chip1Stop

Japan . 950 parts In-Stock

1+ parts

-

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950

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-

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Distributors (In-Stock)

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Vyrian

USA . 395 parts In-Stock

1+ parts

$0.261

100+ parts

-

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395

$0.261

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Digiode

USA . 465 parts In-Stock

1+ parts

$0.273

100+ parts

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465

$0.273

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 103 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

$0.169

103

$0.176

-

-

$0.169

Northwest PG Solutions

USA . 835 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

-

10k+ parts

$0.171

835

$0.194

-

-

$0.171

Corphita

USA . 847 parts In-Stock

1+ parts

$0.258

100+ parts

-

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847

$0.258

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Component Stockers USA

USA . 556,470 parts In-Stock

1+ parts

$0.370

100+ parts

$0.390

1k+ parts

$0.350

10k+ parts

$0.350

556,470

$0.370

$0.390

$0.350

$0.350

Continental Prestige Electronics

USA . 15,000 parts In-Stock

1+ parts

$0.643

100+ parts

$0.432

1k+ parts

$0.301

10k+ parts

-

15,000

$0.643

$0.432

$0.301

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$9.650

100+ parts

$8.782

1k+ parts

$7.913

10k+ parts

-

150

$9.650

$8.782

$7.913

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Corohmni

South Africa . 385 parts In-Stock

1+ parts

$13.164

100+ parts

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385

$13.164

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Modulus Dynamics

Lithuania . 2,858 parts In-Stock

1+ parts

$16.585

100+ parts

$15.922

1k+ parts

$15.258

10k+ parts

-

2,858

$16.585

$15.922

$15.258

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Epart123

USA . 60,000 parts In-Stock

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iodParts Technologies Inc.

India . 45,000 parts In-Stock

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GreenTree Electronics

Israel . 11,400 parts In-Stock

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Perfect Parts

USA . 56 parts In-Stock

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56

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Technical Specifications

Other Function Telecom Interface ICs BGA7M1N6E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

.7 mm

Trade Compliance

BGA7M1N6E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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