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BGA7L1N6E6327XTSA1

Infineon Technologies

BGA7L1N6E6327XTSA1 by Infineon Technologies

Infineon's BGA7L1N6E6327XTSA1 is a telecom interface IC with 6 terminals, operating from -40 to 85°C. It features a small outline, very thin profile package style and requires 1.8V supply voltage. Ideal for industrial applications requiring compact design and high reliability in telecommunications circuits.

Median Price

$0.575

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,152 parts In-Stock

1+ parts

$0.980

100+ parts

$0.687

1k+ parts

$0.448

10k+ parts

$0.382

5,152

$0.980

$0.687

$0.448

$0.382

Rochester

USA . 975,000 parts In-Stock

1+ parts

-

100+ parts

$0.501

1k+ parts

$0.416

10k+ parts

$0.371

975,000

-

$0.501

$0.416

$0.371

DigiKey

USA . 960,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

-

960,000

-

-

$0.630

-

Verical

USA . 585,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.520

10k+ parts

$0.464

585,000

-

-

$0.520

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 462 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

-

462

$0.390

-

-

-

Vyrian

USA . 852 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

-

10k+ parts

-

852

$0.411

-

-

-

Chip Stock

USA . 71,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

71,950

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 797 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$0.370

-

-

-

Native Components

USA . 171 parts In-Stock

1+ parts

$1.030

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$1.030

-

-

-

Northwest PG Solutions

USA . 998 parts In-Stock

1+ parts

$1.133

100+ parts

-

1k+ parts

-

10k+ parts

-

998

$1.133

-

-

-

Modulus Dynamics

Lithuania . 4,443 parts In-Stock

1+ parts

$6.568

100+ parts

$6.305

1k+ parts

$6.043

10k+ parts

-

4,443

$6.568

$6.305

$6.043

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,592

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Upgrade your telecom interface with the BGA7L1N6E6327XTSA1 by Infineon Technologies. Designed with quality in mind, this small outline, very thin profile IC offers exceptional performance and reliability. Perfect for a wide range of applications, this product provides seamless integration and efficient operation. With Infineon's reputation for excellence in manufacturing, you can trust that you're getting a top-of-the-line product that will exceed your expectations. Experience the convenience and value of the BGA7L1N6E6327XTSA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to heat and chemicals, making the product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount design provides easy and efficient installation onto circuit boards, saving space and allowing for automated assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient placement and organization of components on a circuit board, optimizing space usage.

No. of Terminals: 6

Having 6 terminals allows for connectivity to multiple external devices or components, increasing versatility and functionality of the product.

Maximum Operating Temperature: 85 °C

Ability to operate at a high temperature of 85°C ensures reliable performance even in harsh or extreme conditions.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V allows for compatibility with various power sources and efficient power consumption.

Technical Specifications

Other Function Telecom Interface ICs BGA7L1N6E6327XTSA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

.7 mm

Trade Compliance

BGA7L1N6E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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