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BF799E6327HTSA1

Infineon Technologies

BF799E6327HTSA1 by Infineon Technologies

BF799E6327HTSA1 by Infineon Technologies is a NPN RF BJT transistor with 3 terminals. It operates in the ultra high frequency band at 1100 MHz, suitable for switching applications. With a max power dissipation of 0.28 W and a collector-emitter voltage of 20 V, it is designed for small outline surface mount packages.

Median Price

$0.102

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 886 parts In-Stock

1+ parts

-

100+ parts

$0.102

1k+ parts

$0.085

10k+ parts

$0.075

886

-

$0.102

$0.085

$0.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 673 parts In-Stock

1+ parts

$0.079

100+ parts

-

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673

$0.079

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Vyrian

USA . 9,389 parts In-Stock

1+ parts

-

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9,389

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Greenchips

USA . 2,425 parts In-Stock

1+ parts

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2,425

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SIE Connect GmbH - GreenChips

Germany . 2,425 parts In-Stock

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2,425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 445 parts In-Stock

1+ parts

$0.075

100+ parts

-

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445

$0.075

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Modulus Dynamics

Lithuania . 24,871 parts In-Stock

1+ parts

$1.328

100+ parts

$1.275

1k+ parts

$1.222

10k+ parts

-

24,871

$1.328

$1.275

$1.222

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Native Components

USA . 860 parts In-Stock

1+ parts

$5.240

100+ parts

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860

$5.240

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AZTECH Wire

Italy . 1,204 parts In-Stock

1+ parts

$9.370

100+ parts

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1,204

$9.370

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Perfect Parts

USA . 26,074 parts In-Stock

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26,074

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Northwest PG Solutions

USA . 770 parts In-Stock

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100+ parts

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$5.135

10k+ parts

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770

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$5.135

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Overview

Unlocking the power of advanced technology, the BF799E6327HTSA1 by Infineon Technologies is a top-of-the-line RF Small Signal Bipolar Junction Transistor that offers unparalleled quality and performance. Designed for ultra-high frequency band applications, this NPN transistor is perfect for switching needs with its single configuration and small outline package style. With a maximum operating temperature of 150°C and a nominal transition frequency of 1100 MHz, this transistor ensures reliable and efficient operation. Trust in Infineon Technologies to provide innovative solutions that meet your needs and exceed your expectations. Upgrade your electronics with the BF799E6327HTSA1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various environments and applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications, offering reliable performance in electronic circuits.

Configuration: SINGLE

Simplified design with a single transistor configuration, making it easy to use and integrate into circuit layouts.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and responsive performance.

Surface Mount: YES

Suitable for surface mount assembly, saving space and enabling high-density circuit board designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards, optimizing space utilization.

Terminal Form: GULL WING

Gull wing terminals provide secure connection and easy soldering during assembly.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency band, ideal for high-speed applications and communication systems.

No. of Terminals: 3

Simple three-terminal design for easy integration into circuits and circuits layouts.

Maximum Power Dissipation (Abs): 0.28 W

Can handle up to 0.28 watts of power dissipation, ensuring reliable operation under various load conditions.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space and allows for efficient board layout designs.

Minimum DC Current Gain (hFE): 40

Minimum DC current gain of 40 ensures consistent and stable amplification performance.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures up to 150°C, suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 20 V

With a maximum collector-emitter voltage of 20 V, it is suitable for low voltage applications and circuits.

Transistor Element Material: SILICON

Silicon-based transistor element material provides reliable and consistent performance in various operating conditions.

Maximum Collector Current (IC): 0.035 A

Capable of handling up to 0.035 amps of collector current, suitable for low to medium current applications.

Terminal Position: DUAL

Dual terminal position for easy mounting and soldering on circuit boards.

Nominal Transition Frequency (fT): 1100 MHz

High nominal transition frequency of 1100 MHz allows for high-speed switching and amplification performance.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BF799E6327HTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

40

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BF799E6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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