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BAT15-099RE6327

Infineon Technologies

BAT15-099RE6327 by Infineon Technologies

Infineon BAT15-099RE6327 is a Schottky mixer diode with 4 elements, X Band frequency band, and 0.35 pF diode capacitance. It operates b/w -55 to 150 °C and has a max power dissipation of 0.1 W. Ideal for microwave applications requiring low barrier Schottky technology in small outline packages.

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,708 parts In-Stock

1+ parts

$1.430

100+ parts

$0.594

1k+ parts

$0.421

10k+ parts

$0.343

6,708

$1.430

$0.594

$0.421

$0.343

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 2,275 parts In-Stock

1+ parts

$0.750

100+ parts

-

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2,275

$0.750

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Digiode

USA . 543 parts In-Stock

1+ parts

$0.855

100+ parts

-

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543

$0.855

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-

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Vyrian

USA . 435 parts In-Stock

1+ parts

$0.900

100+ parts

-

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435

$0.900

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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6,000

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Rebound Electronics

UK . 2,983 parts In-Stock

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2,983

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Cogito LLC

Ukraine . 2,404 parts In-Stock

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2,404

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 17,242 parts In-Stock

1+ parts

$0.141

100+ parts

$0.135

1k+ parts

$0.130

10k+ parts

-

17,242

$0.141

$0.135

$0.130

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Corphita

USA . 56 parts In-Stock

1+ parts

$0.810

100+ parts

-

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56

$0.810

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Native Components

USA . 841 parts In-Stock

1+ parts

$12.020

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841

$12.020

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Northwest PG Solutions

USA . 1,528 parts In-Stock

1+ parts

$13.222

100+ parts

$11.900

1k+ parts

-

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1,528

$13.222

$11.900

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Andel Nordic

Denmark . 701 parts In-Stock

1+ parts

$53.200

100+ parts

-

1k+ parts

$37.242

10k+ parts

$37.242

701

$53.200

-

$37.242

$37.242

Metaverse IC Inc.

Canada . 93,000 parts In-Stock

1+ parts

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93,000

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Perfect Parts

USA . 31,013 parts In-Stock

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31,013

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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22,000

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Cyclops Electronics Ltd (Excess)

UK . 13,845 parts In-Stock

1+ parts

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13,845

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A-Z Elektronik GmbH

Germany . 11,910 parts In-Stock

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11,910

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Alle Elektronik GmbH

Germany . 1,540 parts In-Stock

1+ parts

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1,540

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Overview

Experience unmatched performance and reliability with the BAT15-099RE6327 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and innovation in their products. This microwave mixer and detector diode, designed for X band applications, features a crossover ring configuration with four elements. With its small outline package style and dual terminal position, this diode offers seamless integration and precise functionality. Trust in the superior technology of Infineon Technologies to deliver exceptional value and benefits to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the mixer and detector diodes, ensuring a longer lifespan for the product.

Frequency Band: X BAND

The X Band frequency band offers a wide range of applications for the mixer and detector diodes, making it suitable for various uses in communication, radar, and other high-frequency applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand intense heat environments, ensuring reliable performance even in challenging conditions.

Technology: SCHOTTKY

The Schottky technology used in these diodes provides fast switching speeds and low forward voltage, making them ideal for high-frequency applications where efficiency and performance are crucial.

Technical Specifications

Microwave Mixer & Detector Diodes BAT15-099RE6327 attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

4 V

Case Connection:

ANODE AND CATHODE

Config:

CROSSOVER RING, 4 ELEMENTS

Maximum Diode Capacitance:

.35 pF

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.41 V

Frequency Band:

X BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

4

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.11 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.1 W

Qualification:

Not Qualified

Sub-Category:

Microwave Mixer Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Schottky Barrier Type:

LOW BARRIER

Trade Compliance

BAT15-099RE6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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