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BA592E6327HTSA1

Infineon Technologies

BA592E6327HTSA1 by Infineon Technologies

Infineon's BA592E6327HTSA1 is a single mixer diode with 1.4 pF capacitance, suitable for very high frequency applications. It features a small outline rectangular package with gull wing terminals and tin finish, making it ideal for surface mount configurations.

Median Price

$0.084

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 38,950 parts In-Stock

1+ parts

$0.190

100+ parts

$0.098

1k+ parts

$0.080

10k+ parts

$0.072

38,950

$0.190

$0.098

$0.080

$0.072

Chip1Stop

Japan . 36,000 parts In-Stock

1+ parts

-

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$0.073

36,000

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$0.073

Rochester

USA . 18,955 parts In-Stock

1+ parts

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$0.084

1k+ parts

$0.070

10k+ parts

$0.062

18,955

-

$0.084

$0.070

$0.062

Verical

USA . 6,000 parts In-Stock

1+ parts

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$0.087

6,000

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$0.087

Arrow

USA . 3,000 parts In-Stock

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$0.071

3,000

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$0.071

Distributors (In-Stock)

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Digiode

USA . 98 parts In-Stock

1+ parts

$0.070

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98

$0.070

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Nova Conductors

Japan . 60 parts In-Stock

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$0.122

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60

$0.122

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Chip Stock

USA . 1,512,500 parts In-Stock

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1,512,500

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Flip Electronics

USA . 156,000 parts In-Stock

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156,000

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IBS Electronics

USA . 60,000 parts In-Stock

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$0.091

60,000

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$0.091

Vyrian

USA . 24,294 parts In-Stock

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24,294

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Bristol Electronics

USA . 16,330 parts In-Stock

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16,330

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NAC Semi

USA . 9,000 parts In-Stock

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$0.308

9,000

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$0.308

TME

Poland . 1,465 parts In-Stock

1+ parts

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100+ parts

$0.142

1k+ parts

$0.133

10k+ parts

$0.116

1,465

-

$0.142

$0.133

$0.116

ACDS - Activité Composants Distribution Service

France . 1,100 parts In-Stock

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1,100

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Holdelec - ElecDif-Pro

France . 1,100 parts In-Stock

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VNN

France . 711 parts In-Stock

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711

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Distributors (Availability)

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Ampacity Inc.

Singapore . 23,845 parts In-Stock

1+ parts

$0.060

100+ parts

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23,845

$0.060

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Corphita

USA . 400 parts In-Stock

1+ parts

$0.067

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400

$0.067

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Modulus Dynamics

Lithuania . 11,708 parts In-Stock

1+ parts

$0.141

100+ parts

$0.135

1k+ parts

$0.130

10k+ parts

-

11,708

$0.141

$0.135

$0.130

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Corohmni

South Africa . 436 parts In-Stock

1+ parts

$0.193

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436

$0.193

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Benley Electronics

USA . 4 parts In-Stock

1+ parts

$3.750

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4

$3.750

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GreenTree Electronics

Israel . 1,730,000 parts In-Stock

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RC Electronics

USA . 108,000 parts In-Stock

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$0.130

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$0.120

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$0.120

108,000

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$0.120

$0.120

Perfect Parts

USA . 105,218 parts In-Stock

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Component Stockers USA

USA . 38,180 parts In-Stock

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100+ parts

$0.120

1k+ parts

$0.110

10k+ parts

$0.050

38,180

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$0.120

$0.110

$0.050

Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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BidChips

USA . 16,330 parts In-Stock

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iBuyXS LLC

. 16,330 parts In-Stock

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16,330

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A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

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10,000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Argo Parts USA

USA . 4,879 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,665 parts In-Stock

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4,665

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Continental Prestige Electronics

USA . 2,913 parts In-Stock

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Microchip USA

USA . 146 parts In-Stock

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146

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Overview

Enhance your electronics projects with the BA592E6327HTSA1 by Infineon Technologies, a top-of-the-line Microwave Mixer & Detector Diode. Infineon Technologies is known for their superior quality and reliability in manufacturing electronic components. This single configuration diode operates in the very high frequency band, making it perfect for a wide range of applications. With its small outline package shape and dual gull wing terminals, this diode offers outstanding performance and precision. Experience seamless integration and exceptional functionality with the BA592E6327HTSA1, the ideal choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable applications.

Config: SINGLE

Single configuration simplifies the setup and operation of the mixer and detector diode, making it user-friendly.

Frequency Band: VERY HIGH FREQUENCY

Very high frequency band capability allows for high-speed and accurate signal processing, suitable for advanced communication systems.

Surface Mount: YES

Surface mount capability enables easy integration onto printed circuit boards, saving space and simplifying manufacturing processes.

Maximum Diode Capacitance: 1.4 pF

Low diode capacitance ensures minimal signal loss and high-speed performance, making it suitable for high-frequency applications.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and alignment on PCBs, enhancing overall system efficiency.

No. of Terminals: 2

Having only 2 terminals simplifies the connection setup and reduces the chances of wiring errors, enhancing reliability.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and facilitates compact designs, suitable for space-constrained applications.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and corrosion resistance, ensuring reliable connections for long-term performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the diode, accommodating different circuit configurations and simplifying installation.

Diode Type: MIXER DIODE

Being a mixer diode, this product is specifically designed for mixing and detecting signals in high-frequency applications, ensuring accurate signal processing.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting on PCBs, improving production efficiency.

Diode Element Material: SILICON

The use of silicon material in the diode element offers good stability and reliability in high-frequency operations, ensuring consistent performance.

Technical Specifications

Microwave Mixer & Detector Diodes BA592E6327HTSA1 attributes and parameters. Explore more Microwave Mixer & Detector Diodes devices from Infineon Technologies

Specs

Config:

SINGLE

Maximum Diode Capacitance:

1.4 pF

Diode Element Material:

SILICON

Diode Type:

Frequency Band:

VERY HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BA592E6327HTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.60

SB

8541.10.00.60

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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