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PI3CH480ZHDEX

Diodes Incorporated

PI3CH480ZHDEX by Diodes Incorporated

Diodes Inc. PI3CH480ZHDEX is a 4-function bus driver with 0.3 ns propagation delay, suitable for bidirectional applications. Operating b/w -40 to 85 °C, it has 2 bits and enables low control type. With a package style of CHIP CARRIER, it's ideal for space-constrained designs requiring fast signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,084 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,084

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 970 parts In-Stock

1+ parts

$19.090

100+ parts

-

1k+ parts

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10k+ parts

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970

$19.090

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Microchip USA

USA . 1,345 parts In-Stock

1+ parts

$19.630

100+ parts

$19.510

1k+ parts

$19.450

10k+ parts

$19.390

1,345

$19.630

$19.510

$19.450

$19.390

QUARKTWIN TECHNOLOGY LTD

USA . 7,528 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,528

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Overview

Unleash the power of seamless data transmission with the PI3CH480ZHDEX by Diodes Incorporated. As a leading manufacturer in bus driver & transceivers, Diodes Incorporated delivers top-quality products that offer unparalleled reliability and performance. Ideal for a wide range of applications, this 4-function device provides customers with a compact solution that enhances efficiency and precision. Elevate your projects with the value, benefits, and advantages that the PI3CH480ZHDEX brings to the table. Experience seamless connectivity like never before.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.3 ns

Low propagation delay ensures fast and efficient signal transmission, making this product ideal for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Multiple functions in one component offer versatility and flexibility in designing circuits, reducing the need for additional components.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the circuit board, especially in compact designs.

No. of Bits: 2

Suitable for applications requiring low-bit data transmission, providing a cost-effective solution for specific design requirements.

Nominal Supply Voltage / Vsup (V): 1.8

Optimal supply voltage ensures stable operation of the product within its specified voltage range, enhancing reliability.

No. of Terminals: 16

Sufficient terminals for connecting multiple input and output signals, enabling complex circuit configurations and communication protocols.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers enhanced thermal performance, compact size, and ease of integration in diverse applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures product reliability in various environmental conditions, suitable for industrial and automotive applications.

Output Characteristics: 3-STATE

3-state output capability allows for high impedance state, facilitating bus sharing and multi-drop communication in complex systems.

Minimum Operating Temperature: -40 °C

Operational reliability in extreme cold temperatures enables the product to function effectively in diverse environments, including outdoor settings.

Terminal Position: QUAD

Quad terminal configuration simplifies connection and routing of signals, reducing signal interference and improving overall signal integrity.

No. of Ports: 2

Dual ports offer flexibility in interfacing with multiple devices or systems, enhancing connectivity and data exchange capabilities.

Maximum Seated Height: 0.65 mm

Low-profile design minimizes board space requirements and allows for compact system integration, ideal for space-constrained applications.

Width: 3 mm

Slim width dimensions enable efficient placement on the circuit board, contributing to a more organized and compact overall system layout.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, reducing errors in data transmission and improving system reliability.

Minimum Supply Voltage (Vsup): 1.62 V

The low minimum supply voltage allows for operation in energy-efficient applications, saving power consumption and extending battery life.

Length: 3 mm

Compact length dimensions facilitate placement flexibility on the circuit board, accommodating space constraints in tight layouts.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable performance, suitable for a wide range of digital applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations, promoting sustainability and reducing environmental impact.

Packing Method: TR

TR (Tape and Reel) packing method offers efficient handling, storage, and assembly of components, streamlining production processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the circuit board, enabling compact system designs and maximizing board space utilization.

Count Direction: BIDIRECTIONAL

Bidirectional count direction facilitates versatile data transmission and communication protocols, supporting diverse system requirements.

Control Type: ENABLE LOW

Enable low control type simplifies operation and integration within control systems, offering ease of use and compatibility with standard protocols.

Maximum Supply Voltage (Vsup): 1.98 V

The high maximum supply voltage tolerance ensures robust operation and protection against voltage spikes, enhancing product durability.

Technical Specifications

Bus Driver & Transceivers PI3CH480ZHDEX attributes and parameters. Explore more Bus Driver & Transceivers devices from Diodes Incorporated

Specs

Additional Features:

ALSO OPERATES AT 3.3V and 2.5V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.3 ns

Maximum Seated Height:

.65 mm

Maximum Supply Voltage (Vsup):

1.98 V

Minimum Supply Voltage (Vsup):

1.62 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

PI3CH480ZHDEX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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