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PI3C3245LEX

Diodes Incorporated

PI3C3245LEX by Diodes Incorporated

PI3C3245LEX by Diodes Inc. is an 8-bit bus driver with a propagation delay of 0.25 ns, operating b/w -40 to 85°C. It features a small outline package with dual terminals and true output polarity, suitable for industrial applications requiring precise signal transmission in tight spaces.

Median Price

$1.390

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,029 parts In-Stock

1+ parts

$1.390

100+ parts

$0.539

1k+ parts

$0.368

10k+ parts

$0.259

3,029

$1.390

$0.539

$0.368

$0.259

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 150,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150,000

-

-

-

-

RC Electronics

USA . 65,266 parts In-Stock

1+ parts

-

100+ parts

$0.350

1k+ parts

$0.320

10k+ parts

$0.310

65,266

-

$0.350

$0.320

$0.310

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Experience seamless and reliable data transmission with the PI3C3245LEX from Diodes Incorporated, a trusted name in the industry. This high-quality bus driver & transceiver is designed to meet your connectivity needs with precision and efficiency. Its advanced features ensure optimal performance in various applications, making it a versatile solution for your projects. Trust in the value and benefits that this product brings, providing you with a competitive edge in today's fast-paced technological landscape. Elevate your designs with the PI3C3245LEX and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the bus driver & transceivers, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage of 3.3V ensures stable and efficient performance of the bus driver & transceivers.

Propagation Delay (tpd): 0.25 ns

Low propagation delay of 0.25ns ensures fast data transmission and response times, making it ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the bus driver & transceivers can function reliably in a variety of environmental conditions.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for high flexibility in controlling the bus driver & transceivers' output signals, enabling efficient communication protocols.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the bus driver & transceivers can withstand harsh operating conditions, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers PI3C3245LEX attributes and parameters. Explore more Bus Driver & Transceivers devices from Diodes Incorporated

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

PI3C3245LEX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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