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PI3C3126QE

Diodes Incorporated

PI3C3126QE by Diodes Incorporated

PI3C3126QE by Diodes Inc. is a 4-function bus driver with 16 terminals, operating at a nominal voltage of 3.3V and power supplies of 2.5/3.3V. Featuring a propagation delay of 0.25ns, it is ideal for industrial applications requiring true output polarity and a max operating temperature of 85°C.

Median Price

$0.820

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 236 parts In-Stock

1+ parts

$0.820

100+ parts

$0.320

1k+ parts

$0.236

10k+ parts

$0.188

236

$0.820

$0.320

$0.236

$0.188

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 562 parts In-Stock

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562

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Bristol Electronics

USA . 104 parts In-Stock

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104

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Atlantic Semiconductor

USA . 104 parts In-Stock

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104

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Speed Components Ltd

Israel . 76 parts In-Stock

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76

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Connector Distribution Corp

USA . 40 parts In-Stock

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40

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Right Parts Inc.

USA . 40 parts In-Stock

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40

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R&J Components

USA . 35 parts In-Stock

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35

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 7,988 parts In-Stock

1+ parts

$0.550

100+ parts

$0.350

1k+ parts

$0.300

10k+ parts

-

7,988

$0.550

$0.350

$0.300

-

Andel Nordic

Denmark . 3,193 parts In-Stock

1+ parts

$10.125

100+ parts

-

1k+ parts

$9.720

10k+ parts

$9.720

3,193

$10.125

-

$9.720

$9.720

Lixinc

USA . 19,440 parts In-Stock

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19,440

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Perfect Parts

USA . 1,107 parts In-Stock

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1,107

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Kepictronics

USA . 686 parts In-Stock

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686

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Futuretech Components

Singapore . 200 parts In-Stock

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200

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Overview

Unlock unparalleled performance and reliability with the PI3C3126QE by Diodes Incorporated, a leading manufacturer known for superior quality and innovation. This versatile bus driver & transceiver is designed to meet the demands of various applications, offering customers unmatched value and efficiency. With its advanced features and cutting-edge technology, this product ensures optimal performance and seamless operation, making it the ideal choice for your next project. Experience the difference with Diodes Incorporated and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good durability and reliability for the Bus Driver & Transceivers.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and making installation more convenient.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in various applications.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25 ns ensures fast signal transmission, making this product suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range (-40 to 85°C), ensuring reliable operation in harsh environments.

Technical Specifications

Bus Driver & Transceivers PI3C3126QE attributes and parameters. Explore more Bus Driver & Transceivers devices from Diodes Incorporated

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

PI3C3126QE Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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