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DMN95H8D5HCTI

Diodes Incorporated

DMN95H8D5HCTI by Diodes Incorporated

DMN95H8D5HCTI by Diodes Inc. is a N-CHANNEL Power FET with 950V DS Breakdown Voltage and 3A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has an RDS(on) of 7 ohm and EAS of 97mJ for efficient performance.

Median Price

$1.535

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$1.270

100+ parts

$0.908

1k+ parts

$0.639

10k+ parts

$0.547

15

$1.270

$0.908

$0.639

$0.547

DigiKey

USA . 8 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$1.800

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

12

$1.080

-

-

-

Microchip USA

USA . 161 parts In-Stock

1+ parts

$8.125

100+ parts

-

1k+ parts

-

10k+ parts

-

161

$8.125

-

-

-

Northwest PG Solutions

USA . 1,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,763

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-

-

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Native Components

USA . 919 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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919

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Overview

Experience the superior performance and reliability of the DMN95H8D5HCTI Power FET from Diodes Incorporated. With a focus on quality and innovation, Diodes Incorporated is a trusted manufacturer in the industry. This N-CHANNEL transistor with a single configuration and built-in diode is ideal for switching applications. Offering a high DS breakdown voltage of 950V and maximum pulsed drain current of 3A, this FET delivers exceptional value and benefits to customers. Trust Diodes Incorporated for cutting-edge technology and unmatched performance in power semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher conductivity, making them ideal for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and helps protect the circuit from voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides reliable and efficient performance in power control circuits.

Minimum DS Breakdown Voltage: 950 V

With a high breakdown voltage, this FET can handle high voltage levels, making it suitable for a wide range of power applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy installation and mounting on a circuit board or heat sink.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, ensuring stable operation of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low ON-resistance, making them ideal for high-frequency switching applications.

Maximum Pulsed Drain Current (IDM): 3 A

The high pulsed drain current rating allows the FET to handle short-term peak currents, providing reliable performance in demanding applications.

Avalanche Energy Rating (EAS): 97 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events without damage.

No. of Terminals: 3

Having three terminals allows for easy connection and integration into a circuit, simplifying the design and assembly process.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation, ensuring reliable operation under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making this FET suitable for power switching applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing stable performance over a wide temperature range.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, ensuring a reliable electrical connection.

Maximum Drain-Source On Resistance: 7 ohm

The low ON-resistance of the FET results in minimal power loss and high efficiency in power switching applications.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and reduces the risk of error during installation.

Case Connection: ISOLATED

Isolated case connection helps prevent electrical interference and ensures safe operation in high voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature allows for efficient soldering and assembly processes, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and prevents component failure during the manufacturing process.

Technical Specifications

Power Field Effect Transistors (FET) DMN95H8D5HCTI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

97 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

950 V

Maximum Drain-Source On Resistance:

7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

3 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN95H8D5HCTI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

Category top products 20

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