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CYBL10563-68FNXI

Cypress Semiconductor

CYBL10563-68FNXI by Cypress Semiconductor

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 68; Package Code: VFBGA; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 779 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 256 parts In-Stock

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256

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Ampacity Inc.

Singapore . 802 parts In-Stock

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$20.000

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802

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Corohmni

South Africa . 2,480 parts In-Stock

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$69.874

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Modulus Dynamics

Lithuania . 1,726 parts In-Stock

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$85.395

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$81.979

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A-Z Elektronik GmbH

Germany . 7,038 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,692 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 782 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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Technical Specifications

Multi-functional Peripherals CYBL10563-68FNXI attributes and parameters. Explore more Multi-functional Peripherals devices from Cypress Semiconductor

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB

Maximum Clock Frequency:

48 MHz

JESD-30 Code:

R-PBGA-B68

Length:

3.91 mm

No. of I/O Lines:

36

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

8192

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.52 mm

Trade Compliance

CYBL10563-68FNXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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