Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CY7C4211V-15AXI by Cypress Semiconductor is a FIFO with 512x9 organization, 15 ns cycle time, and 66.7 MHz clock frequency. It operates synchronously at 3.3V, suitable for industrial applications requiring fast data storage and retrieval in compact spaces.
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$15.238
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Rochester
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100+ parts
$12.190
1k+ parts
$10.910
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$10.260
DigiKey
$16.040
Verical
Vyrian
Nova Conductors
Ampacity Inc.
$25.120
A-Z Elektronik GmbH
QUARKTWIN TECHNOLOGY LTD
Alle Elektronik GmbH
Microchip USA
Aranea Global
Provides reliable and durable packaging for the FIFO, ensuring long-term performance.
Fast cycle time allows for quick data access and processing, improving overall efficiency.
Operates at a standard voltage level, making it compatible with a wide range of systems.
Can withstand high temperatures, suitable for industrial environments.
CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliability.
Specifically designed for FIFO operation, ensuring optimal performance in data storage and retrieval.
FIFO CY7C4211V-15AXI attributes and parameters. Explore more FIFO devices from Cypress Semiconductor
Maximum Access Time:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
CY7C4211V-15AXI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Obsolescence/ EOL - EOL 22/Dec/2016
PCN Design/Specification - Copper Alloy Update 05/Dec/2014
PCN Assembly/Origin - Assembly Site Transfer 22/Jun/2015
PCN Packaging - Date Code/Shelf Life Chgs 18/Jul/2019 Ship Label REV
Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148W-T
Rectron
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
Telefunken Microelectronics
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
261
Deltrol Controls
Other Relays;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
BSS123,215
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
7202LA20LB8
Renesas Electronics
Renesas Electronics' 7202LA20LB8 is a CMOS FIFO chip carrier with 1Kx9 organization, operating at 33.3MHz clock frequency and 30ns cycle time. Ideal for military applications due to MIL-STD-883 Class B screening level, it features asynchronous operation and offers a memory density of 9216 bits.
SN74ABT3612-20PQ
SN74ABT3612-20PQ by Texas Instruments is a 64x36 bi-directional FIFO memory IC with a cycle time of 20 ns and max clock frequency of 50 MHz. It operates in synchronous mode, has a memory density of 2304 bit, and supports parallel data transfer. This device is ideal for applications requiring fast and efficient data storage and retrieval in commercial temperature environments.
SN74ACT3632-30PCB
SN74ACT3632-30PCB by Texas Instruments is a FIFO memory with 512x36 organization, operating at 30 ns cycle time and 33.4 MHz clock frequency. It is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ABT7819-10PNR
SN74ABT7819-10PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 10ns and synchronous operation, suitable for applications requiring fast data transfer and memory management in commercial-grade environments. The package style is flatpack with low profile and fine pitch, making it ideal for space-constrained designs.
SN74ACT7204L-15DVR
SN74ACT7204L-15DVR by Texas Instruments is a 4Kx9 FIFO with 25ns cycle time and 15ns access time. It operates at 5V, has 28 terminals, and supports parallel mode. Ideal for applications requiring fast data transfer in commercial temperature environments.
SN74ACT3651-20PQ
SN74ACT3651-20PQ by Texas Instruments is a 2Kx36 CMOS FIFO memory IC with 20ns cycle time, operating at 5V. It features synchronous operation, 50MHz clock frequency, and 3-STATE output characteristics. Ideal for applications requiring high-speed data buffering and storage in commercial temperature environments.
SN54ACT7811GB
SN54ACT7811GB by Texas Instruments is a FIFO with 1KX18 organization, 28.5 MHz clock frequency, and 35.08 ns cycle time. Ideal for military applications requiring a memory density of 18432 bit, it operates synchronously at temperatures ranging from -55 to 125 °C.
SN74ACT2235-60PAG
SN74ACT2235-60PAG by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 60 ns cycle time and 16.7 MHz clock frequency. It features a 64-terminal flatpack package suitable for commercial temperature grades. Ideal for applications requiring bi-directional parallel memory with output enable functionality.
SN74ACT72231L35RJ
SN74ACT72231L35RJ by Texas Instruments is a 2Kx9 FIFO chip with CMOS technology. It operates synchronously at 5V, with a memory density of 18432 bits and output enable feature. This rectangular chip carrier package is surface mountable and suitable for commercial temperature grades in applications requiring parallel data transfer.
SN74ACT72235-30FNR
SN74ACT72235-30FNR by Texas Instruments is a FIFO chip with 1KX9 organization, 30.3 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems. The chip comes in a square plastic/epoxy package with 44 terminals for surface mount installation.
SN74ACT7201LA15NP
SN74ACT7201LA15NP by Texas Instruments is a FIFO memory IC with 512x9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and operates on a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT7815-15PQ
SN74ABT7815-15PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with synchronous operation at 67MHz. It operates on a 5V supply, has a max access time of 10ns, and can withstand temperatures from 0 to 70°C. This device is ideal for applications requiring fast data transfer and storage in commercial-grade environments.
IDT7202LA25SOI8
Integrated Device Technology
IDT7202LA25SOI8 by Integrated Device Technology is a FIFO with 1KX9 organization, operating at 5V. It has a cycle time of 35ns and max clock frequency of 28.5MHz, suitable for industrial applications requiring fast data storage and retrieval in parallel mode. With a small outline package style and Gull Wing terminal form, it offers reliable performance in temperature ranges from -40 to 85°C.
72V241L15PFGI8
Renesas Electronics' 72V241L15PFGI8 FIFO operates synchronously with a cycle time of 15 ns. It features a memory density of 36864 bit and an organization of 4KX9, making it ideal for industrial applications requiring fast access times. With parallel operation and output enable functionality, this FIFO is suitable for various high-speed data processing tasks.
IDT72V215L15TFGI
The Renesas Electronics IDT72V215L15TFGI FIFO features 512x18 organization, 15ns cycle time, and operates at 3.3V. Ideal for industrial applications requiring fast data access with a max temperature of 85°C.
SN74ACT3642-20PCB
SN74ACT3642-20PCB by Texas Instruments is a FIFO memory with 1Kx36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a CMOS technology, operates at 5V supply voltage, and has a memory density of 36864 bits. This device is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.
SN74ABT3614-30PCBR
SN74ABT3614-30PCBR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and synchronous operation, suitable for commercial temperature grade environments.
SN74ABT7820-25PN
SN74ABT7820-25PN by Texas Instruments is a FIFO memory IC with 512x18 organization, 25 ns cycle time, and 40 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7208L20JG
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
IDT7208L25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.55 mm;
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CY7C421-20JXC
Cypress Semiconductor
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
CY7C4201-10AC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Output Enable: YES;
CY7C4201-10JC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;
CY7C4291V-15JC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Equivalence Code: LDCC32,.5X.6;
CY7C4275V-15ASXC
Infineon Technologies
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;
CY7C419-15AC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, THIN PROFILE;
CY7C419-15JXCT
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 2304 bit;
CY7C420-40PC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
CY7C4201-15JC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; No. of Words Code: 256;
CY7C4205-15AXCT
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Width: 14 mm;
CY7C421-15AXC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Terminal Position: QUAD;
CY7C4235-15AC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 5.5 V;
CY7C4235-15AXCT
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
CY7C4255V-15ASXC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Standby Current: .004 Amp;
CY7C4255V-25ASC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;
CY7C4265-10AXI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
CY7C4271-15AXC
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Qualification: Not Qualified;
CY7C4285V-15ASXC
CY7C4285V-15ASXI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Technology: CMOS;
CY7C4211V-15AIT
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Terminal Pitch: .8 mm;
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