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MAX7349ATG+T

Analog Devices

MAX7349ATG+T by Analog Devices

MAX7349ATG+T by Analog Devices is a 24-terminal IC with supply voltage range of 2.4V to 3.6V, operating temperature from -40 °C to 125°C. It's a MICROPROCESSOR CIRCUIT suitable for automotive applications due to its BICMOS technology and low power consumption of 0.1mA at 3.3V supply voltage.

Median Price

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3

In-Stock Inventory

1k+

MAX7349ATG+T by Analog Devices
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Vyrian

USA . 7,651 parts In-Stock

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Digiode

USA . 2,280 parts In-Stock

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Anansix

USA . 1,906 parts In-Stock

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One Stop Electronics

USA . 1,791 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 326 parts In-Stock

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$10.162

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326

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Semicontronic

India . 435 parts In-Stock

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$22.000

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$21.450

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$21.340

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435

$22.000

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$21.340

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MARBEL Systems

Belgium . 200 parts In-Stock

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$22.644

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Texas Native Microelectronics

USA . 800 parts In-Stock

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$26.028

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$22.905

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$26.028

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$22.905

Kenton Components

USA . 3,039 parts In-Stock

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$31.234

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$29.984

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$29.047

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$27.486

3,039

$31.234

$29.984

$29.047

$27.486

Corohmni

South Africa . 272 parts In-Stock

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$55.634

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Qasali Group International

UK . 2,399 parts In-Stock

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$70.276

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$61.843

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Component Stockers USA

USA . 734 parts In-Stock

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$99.990

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Kepictronics

USA . 28,741 parts In-Stock

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Microchip USA

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Corphita

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Authorized Procurement Solutions

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Overview

Elevate your electronic designs with the MAX7349ATG+T by Analog Devices, a top-tier manufacturer known for delivering high-quality products. This versatile peripheral IC offers unrivaled performance and reliability in a compact square package, making it ideal for various applications in the automotive industry and beyond. With a nominal supply voltage of 3.3V and a low maximum supply current of only 0.1mA, this innovative microprocessor circuit ensures optimal efficiency and seamless functionality. Upgrade your projects today with the MAX7349ATG+T and experience the difference that superior technology can bring.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall production costs.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power supply systems, making this product versatile and adaptable.

Package Shape: SQUARE

Square package shape provides stability and ease of mounting, ensuring secure placement on the circuit board.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, offering flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 24

Sufficient number of terminals for connecting to various components and peripherals, enabling complex circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Includes heat sink and thin profile for efficient heat dissipation and space-saving design, ensuring optimal performance in compact devices.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage allows for efficient power consumption and operation in energy-efficient devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliability and stability in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables operation in extreme cold environments, enhancing the product's durability and versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and reliable electrical connections, ensuring long-term functionality of the product.

Terminal Position: QUAD

Quad terminal configuration enables efficient signal transfer and connectivity, contributing to overall performance and reliability.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for slim and compact design, ideal for space-constrained applications.

Width: 4 mm

Compact width dimensions enable easy integration into circuit layouts and PCB designs, optimizing space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps in fast and efficient soldering process during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering and thermal stability during manufacturing processes.

Length: 4 mm

Compact length dimensions allow for flexibility in placement and mounting, suitable for various device designs and layouts.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature support ensures reliable performance in harsh automotive environments, making it suitable for automotive applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type enhances processing capabilities and enables complex computations, ideal for high-performance applications.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS technologies, providing high-speed operations and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices.

Maximum Supply Current: 0.1 mA

Low maximum supply current requirement minimizes power consumption, contributing to energy efficiency and prolonged battery life.

Nominal Supply Voltage: 3.3 V

Stable and reliable nominal supply voltage ensures consistent performance and compatibility with standard voltage requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise and compact connections, facilitating high-density circuit layouts and miniaturized designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MAX7349ATG+T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

Additional Features:

MONITORS UP TO 64 KEYS

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MAX7349ATG+T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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