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MAX7349AEG+T

Analog Devices

MAX7349AEG+T by Analog Devices

Analog Devices' MAX7349AEG+T is a BICMOS microprocessor circuit with 24 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 2.4-3.6 V and consumes 0.1 mA current at max. Ideal for automotive applications due to its small outline package and dual terminal position.

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MAX7349AEG+T by Analog Devices
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Vyrian

USA . 10,587 parts In-Stock

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Anansix

USA . 2,635 parts In-Stock

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Digiode

USA . 946 parts In-Stock

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Vigor

Singapore . 3,990 parts In-Stock

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$2.353

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$2.353

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Semicontronic

India . 271 parts In-Stock

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$3.000

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$2.925

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$2.910

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271

$3.000

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$2.910

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AZTECH Wire

Italy . 218 parts In-Stock

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$13.026

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Corohmni

South Africa . 1,201 parts In-Stock

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One Stop Electronics

USA . 3,143 parts In-Stock

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$32.000

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MARBEL Systems

Belgium . 46 parts In-Stock

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$50.078

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$48.075

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Texas Native Microelectronics

USA . 85 parts In-Stock

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$57.561

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$55.259

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$53.532

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85

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Kenton Components

USA . 576 parts In-Stock

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$69.073

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$60.784

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QUARKTWIN TECHNOLOGY LTD

USA . 12,221 parts In-Stock

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Microchip USA

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Qasali Group International

UK . 3,883 parts In-Stock

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$136.765

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Corphita

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Authorized Procurement Solutions

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Overview

Elevate your electronics projects with the MAX7349AEG+T by Analog Devices, a top-of-the-line peripheral IC that delivers unmatched quality and reliability. From its cutting-edge BICMOS technology to its automotive-grade temperature grade, this product is designed to exceed expectations. Perfect for a wide range of applications, this microprocessor circuit offers customers unparalleled value and benefits, making it a must-have component for any project requiring precision and performance. Elevate your designs with Analog Devices today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a variety of systems.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a circuit board, maximizing the functionality of the device.

Power Supplies (V): 2.5/3.3

The dual power supply option provides versatility in power management, allowing the device to operate at different voltage levels as needed.

No. of Terminals: 24

The higher number of terminals enables more connectivity options and functionality, making the product suitable for complex applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions, making it suitable for industrial and automotive use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the device to function effectively in cold environments, enhancing its usability in a range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring stable electrical connections for long-term reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options on the circuit board, allowing for optimal placement and layout design.

Maximum Seated Height: 1.73 mm

The low maximum seated height helps conserve space and allows for compact design integration, making it suitable for small form factor applications.

Width: 3.9 mm

The compact width measurement contributes to the overall small footprint of the product, enabling efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature reduces the risk of thermal damage during soldering, ensuring the integrity of the device's components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering processes, ensuring secure and durable connections for the device.

Length: 8.65 mm

The moderate length measurement strikes a balance between compact design and functionality, offering a versatile form factor for various applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification indicates suitability for use in automotive applications, meeting industry standards for temperature resistance and reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities, enabling advanced functionality and performance.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed performance and low power consumption for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance in the product.

Maximum Supply Current: 0.1 mA

The low maximum supply current requirement helps optimize power efficiency and minimize energy consumption, making the product cost-effective to operate.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specification ensures stable and consistent power supply for the device, promoting reliability and performance consistency.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for high-density mounting on a circuit board, enabling the product to accommodate complex circuit designs and save space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MAX7349AEG+T attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

MAX7349AEG+T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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